Abstract:A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. For small-scale applications and during the ASIC and sensor development phase, interconnect technologies must also be suitable for the assembly of single-dies typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D program and the AIDAinnova collaboration, innovative and scalable hybridization concepts are under development for pixel-detector applications in future colliders. This contribution presents recent results of a newly developed in-house single-die interconnection process based on Anisotropic Conductive Adhesives (ACA). The ACA interconnect technology replaces solder bumps with conductive micro-particles embedded in an epoxy layer applied as either film or paste. The electro-mechanical connection between the sensor and ASIC is achieved via thermocompression of the ACA using a flip-chip device bonder. A specific pixel-pad topology is required to enable the connection via micro-particles and create cavities into which excess epoxy can flow. This pixel-pad topology is achieved with an in-house Electroless Nickel Immersion Gold process that is also under development within the project. The ENIG and ACA processes are qualified with a variety of different ASICs, sensors, and dedicated test structures, with pad diameters ranging from 12 {\mu}m to 140 {\mu}m and pitches between 20 {\mu}m and 1.3 mm. The produced assemblies are characterized electrically, with radioactive-source exposures, and in tests with high-momentum particle beams. A focus is placed on recent optimization of the plating and interconnect processes, resulting in an improved plating uniformity and interconnect yield.

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to develop a reliable and cost - effective interconnection technology for the application of hybrid pixel detectors. Specifically, the paper presents a newly - developed single - chip interconnection process based on Anisotropic Conductive Adhesives (ACA). This technology uses conductive particles embedded in an epoxy resin layer to replace the traditional solder bump connection method. The electromechanical connection between the sensor and the ASIC is achieved through thermocompression bonding technology, and the ACA technology can also be used for the integration of the ASIC and the PCB/FPC to replace wire bonding or large - pitch solder bump technology. The key challenges mentioned in the paper include: - **Fine - pitch applications**: For small - size and high - density pixel pad layouts, it is necessary to optimize the interconnection technology and surface treatment process to ensure good electrical connection and mechanical stability. - **Multi - Project - Wafer (MPW)**: When performing single - chip interconnection on a multi - project wafer, since large - scale processing cannot be carried out at the wafer level, it is necessary to develop an interconnection technology suitable for single - chips. - **Surface treatment**: In order to achieve reliable ACA interconnection, special treatment needs to be carried out on the surfaces of the sensor and the ASIC, such as Electroless Nickel Immersion Gold (ENIG) plating, to provide surface characteristics suitable for ACA connection. The paper verifies the effectiveness of these technologies through experiments and shows the performance of different types of ASICs, sensors and dedicated interconnection test structures. The research results show that this new interconnection technology has a high connection yield and reliability in multiple application scenarios.

Pixel detector hybridization and integration with anisotropic conductive adhesives

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