Beam test of a 180 nm CMOS Pixel Sensor for the CEPC vertex detector

Tianya Wu,Shuqi Li,Wei Wang,Jia Zhou,Ziyue Yan,Yiming Hu,Xiaoxu Zhang,Zhijun Liang,Wei Wei,Ying Zhang,Xiaomin Wei,Xinhui Huang,Lei Zhang,Ming Qi,Hao Zeng,Xuewei Jia,Jun Hu,Jinyu Fu,Hongyu Zhang,Gang Li,Linghui Wu,Mingyi Dong,Xiaoting Li,Raimon Casanova,Liang Zhang,Jianing Dong,Jia Wang,Ran Zheng,Weiguo Lu,Sebastian Grinstein,João Guimarães da Costa

2023-11-10

Abstract:The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of pixel size and material budget. A Monolithic Active Pixel Sensor (MAPS) prototype called TaichuPix, based on a column drain readout architecture, has been developed to address the need for high spatial resolution. In order to evaluate the performance of the TaichuPix-3 chips, a beam test was carried out at DESY II TB21 in December 2022. Meanwhile, the Data Acquisition (DAQ) for a muti-plane configuration was tested during the beam test. This work presents the characterization of the TaichuPix-3 chips with two different processes, including cluster size, spatial resolution, and detection efficiency. The analysis results indicate the spatial resolution better than 5 $\mu m$ and the detection efficiency exceeds 99.5 % for both TaichuPix-3 chips with the two different processes.

Instrumentation and Detectors,High Energy Physics - Experiment

What problem does this paper attempt to address?

This paper aims to address the new challenges in pixel size and material budget for the Circular Electron - Positron Collider (CEPC) vertex detector proposed in China. Specifically, the CEPC project requires the vertex detector to have high spatial resolution while maintaining low power consumption to enable forced - air cooling, and the material budget for each detector layer should be as low as possible to reduce the impact of multiple scattering. To this end, the research team has developed a Monolithic Active Pixel Sensor (MAPS) prototype - TaichuPix based on 180 - nanometer CMOS imaging sensor technology to meet these requirements.

To evaluate the performance of the TaichuPix - 3 chip, the research team conducted a beam test at DESY II TB21 in December 2022 and simultaneously tested the data acquisition (DAQ) system in a multi - plane configuration. The test results show that, whether it is the TaichuPix - 3 chip using the standard back - biased diode process or the process without an additional deep N - layer, its spatial resolution is better than 5 μm and the detection efficiency exceeds 99.5%.

Through this research, the authors hope to verify whether the TaichuPix - 3 chip can meet the design goals of the CEPC vertex detector, that is, the spatial resolution of the inner layer is better than 3 μm, the detection efficiency reaches 99%, and the power consumption is lower than 50 mW·cm\(^{-2}\). In addition, the research also explores the impact of different manufacturing processes on chip performance, especially the differences between the standard back - biased diode process and the process without an additional deep N - layer. These results are of great significance for the future design and optimization of the CEPC vertex detector.