Electrical Impedance Tomography: A Fair Comparative Study on Deep Learning and Analytic-based Approaches

Derick Nganyu Tanyu,Jianfeng Ning,Andreas Hauptmann,Bangti Jin,Peter Maass

2023-10-28

Abstract:Electrical Impedance Tomography (EIT) is a powerful imaging technique with diverse applications, e.g., medical diagnosis, industrial monitoring, and environmental studies. The EIT inverse problem is about inferring the internal conductivity distribution of an object from measurements taken on its boundary. It is severely ill-posed, necessitating advanced computational methods for accurate image reconstructions. Recent years have witnessed significant progress, driven by innovations in analytic-based approaches and deep learning. This review explores techniques for solving the EIT inverse problem, focusing on the interplay between contemporary deep learning-based strategies and classical analytic-based methods. Four state-of-the-art deep learning algorithms are rigorously examined, harnessing the representational capabilities of deep neural networks to reconstruct intricate conductivity distributions. In parallel, two analytic-based methods, rooted in mathematical formulations and regularisation techniques, are dissected for their strengths and limitations. These methodologies are evaluated through various numerical experiments, encompassing diverse scenarios that reflect real-world complexities. A suite of performance metrics is employed to assess the efficacy of these methods. These metrics collectively provide a nuanced understanding of the methods' ability to capture essential features and delineate complex conductivity patterns. One novel feature of the study is the incorporation of variable conductivity scenarios, introducing a level of heterogeneity that mimics textured inclusions. This departure from uniform conductivity assumptions mimics realistic scenarios where tissues or materials exhibit spatially varying electrical properties. Exploring how each method responds to such variable conductivity scenarios opens avenues for understanding their robustness and adaptability.

Machine Learning,Artificial Intelligence,Computational Engineering, Finance, and Science,Computer Vision and Pattern Recognition,Numerical Analysis