3D photonics for ultra-low energy, high bandwidth-density chip data links

Stuart Daudlin,Anthony Rizzo,Sunwoo Lee,Devesh Khilwani,Christine Ou,Songli Wang,Asher Novick,Vignesh Gopal,Michael Cullen,Robert Parsons,Alyosha Molnar,Keren Bergman

2023-10-03

Abstract:Artificial intelligence (AI) hardware is positioned to unlock revolutionary computational abilities across diverse fields ranging from fundamental science [1] to medicine [2] and environmental science [3] by leveraging advanced semiconductor chips interconnected in vast distributed networks. However, AI chip development has far outpaced that of the networks that connect them, as chip computation speeds have accelerated a thousandfold faster than communication bandwidth over the last two decades [4, 5]. This gap is the largest barrier for scaling AI performance [6, 7] and results from the disproportionately high energy expended to transmit data [8], which is two orders of magnitude more intensive than computing [9]. Here, we show a leveling of this long-standing discrepancy and achieve the lowest energy optical data link to date through dense 3D integration of photonic and electronic chips. At 120 fJ of consumed energy per communicated bit and 5.3 Tb/s bandwidth per square millimeter of chip area, our platform simultaneously achieves a twofold improvement in both energy consumption and bandwidth density relative to prior demonstrations [10, 11]. These improvements are realized through employing massively parallel 80 channel microresonator-based transmitter and receiver arrays operating at 10 Gb/s per channel, occupying a combined chip footprint of only 0.32 mm2. Furthermore, commercial complementary metal-oxide-semiconductor (CMOS) foundries fabricate both the electronic and photonic chips on 300 mm wafers, providing a clear avenue to volume scaling. Through these demonstrated ultra-energy efficient, high bandwidth data communication links, this work eliminates the bandwidth bottleneck between spatially distanced compute nodes and will enable a fundamentally new scale of future AI computing hardware without constraints on data locality.

Optics,Applied Physics

What problem does this paper attempt to address?

The paper aims to address the bottleneck issue of data communication in artificial intelligence (AI) hardware, particularly concerning energy efficiency and bandwidth density in large-scale distributed networks. Specifically, although the development speed of AI chips far exceeds that of the networks connecting these chips, leading to energy consumption for data transmission being much higher than that for computation itself, this has become a major obstacle to scaling AI performance. To solve this problem, the paper proposes a technology for optical data links with the lowest energy consumption through dense three-dimensional integration of photonic and electronic chips. This technology achieves a bandwidth density of 5.3 terabits per second per square millimeter of chip area with an energy consumption of 120 femtojoules per bit, significantly improving both energy consumption and bandwidth density compared to previous technologies. Additionally, this technology leverages commercial complementary metal-oxide-semiconductor (CMOS) foundries to manufacture electronic and photonic chips, providing the potential for large-scale mass production. This could eliminate the data locality constraints between computing nodes, enabling future AI computing hardware to reach unprecedented scales.