Emerging Devices and Packaging Strategies for Electronic-Photonic AI Accelerators

Nicola Peserico,Thomas Ferreira De Lima,Paul R. Prucnal,Volker J. Sorger
DOI: https://doi.org/10.48550/arXiv.2112.12844
2021-12-24
Abstract:The field of mimicking the structure of the brain on a chip is experiencing interest driven by the demand for machine intelligent applications. However, the power consumption and available performance of machine-learning (ML) accelerating hardware still leave much desire for improvement. In this letter, we share viewpoints, challenges, and prospects of electronic-photonic neural network (NN) accelerators. Combining electronics with photonics offers synergistic co-design strategies for high-performance AI Application-specific integrated circuits (ASICs) and systems. Taking advantages of photonic signal processing capabilities and combining them with electronic logic control and data storage is an emerging prospect. However, the optical component library leaves much to be desired and is challenged by the enormous size of photonic devices. Within this context, we will review the emerging electro-optic materials, functional devices, and systems packaging strategies that, when realized, provide significant performance gains and fuel the ongoing AI revolution, leading to a stand-alone photonics-inside AI ASIC 'black-box' for streamlined plug-and-play board integration in future AI processors.
Applied Physics,Emerging Technologies
What problem does this paper attempt to address?
The problem this paper attempts to address is the high power consumption and insufficient performance of electronic-photonic AI accelerators in achieving high-performance machine learning applications. Specifically, the paper focuses on how to design efficient neural network accelerators by combining electronic and photonic technologies to improve processing speed, reduce energy consumption, and overcome the limitations of existing hardware in large-scale neural network implementations. The paper discusses emerging materials, functional devices, and system packaging strategies aimed at overcoming the main obstacles in current electronic-photonic integrated systems, such as the size and state retention capability of photonic devices, thereby promoting the development of AI hardware.