Electrochemical Polishing of Chemical Vapor Deposited Niobium Thin Films

Zeming Sun,Mingqi Ge,James T. Maniscalco,Victor Arrieta,Shawn R. McNeal,Matthias U. Liepe

DOI: https://doi.org/10.1016/j.tsf.2023.139948

2023-01-03

Abstract:Combining chemical vapor deposition (CVD) with electrochemical polish (EP) operations is a promising route to producing performance-capable superconducting films for use in the fabrication of cost-effective components for superconducting radiofrequency (SRF) particle accelerators and superconducting quantum computers. The post-deposition EP process enables a critically necessary reduction in surface roughness of niobium thin films to promote optimal superconducting surface conditions. In this work, surface morphology, roughness, and crystal orientation of the CVD-grown and EP-polished niobium films were investigated. The grain growth and polishing mechanisms were analyzed. The CVD films were found to comprise steps, kinks, and pyramidal features, resulting in undesirable large peak-to-valley distances. The electrochemical polish was demonstrated to significantly diminish the height of pyramids and effectively minimize the overall surface roughness. In contrast to buffered chemical polishing (BCP), EP results showed a probable dependence on crystal orientation, suggesting this process was influenced by locally enhanced current density and thickness variations of oxide dielectrics. These understandings identify the EP principles tied to CVD-grown Nb films that allow further refinement of surface profiles for film-based SRF applications

Materials Science,Accelerator Physics,Applied Physics

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to reduce the surface roughness of chemical vapor deposition (CVD) niobium (Nb) thin films through electrochemical polishing (EP) technology, in order to improve their performance in superconducting radio - frequency (SRF) applications. Specifically, the paper focuses on the following aspects:

1. **Surface Morphology and Roughness**:
- The paper points out that the surfaces of CVD - grown niobium thin films have steps, kinks, and pyramid - like features, resulting in relatively large surface roughness, which can affect superconducting performance. Therefore, the researchers hope to effectively reduce these features, especially the height of the pyramids and the overall surface roughness, through electrochemical polishing technology.

2. **Effect of Crystal Orientation**:
- It has been found that the electrochemical polishing process may depend on crystal orientation, indicating that the locally enhanced current density and the change in oxide dielectric layer thickness have a significant impact on the polishing effect. This dependence is different from that of the traditional buffered chemical polishing (BCP) method, which usually does not show obvious crystal orientation dependence.

3. **Polishing Mechanisms**:
- The paper analyzes the macroscopic and microscopic polishing mechanisms in the electrochemical polishing process. Macroscopic polishing mainly occurs in high - curvature regions such as pyramids, while microscopic polishing involves the smoothing of steps and kinks. The researchers verified the existence of these two mechanisms through experimental data and explored their contributions to the reduction of surface roughness.

4. **Application Prospects**:
- By combining CVD technology and electrochemical polishing, the researchers hope to develop a feasible method for producing cost - effective superconducting thin films, which can be applied in fields such as SRF accelerators and superconducting quantum computers.

In conclusion, the main objective of this paper is to improve the surface quality of CVD niobium thin films through electrochemical polishing technology, thereby enhancing their performance in superconducting applications.