Abstract:During the high pressure torsion (HPT) of a material, a steady-state is reached after a certain number of the plunger revolutions. This steady-state is determined by the dynamic equilibrium between the formation of crystal lattice defects during deformation and their relaxation. In particular, during HPT of binary solid solutions, the competition takes place between the dissolution of particles of the second phase (and enrichment of the solid solution), on the one hand, and the decomposition of the solid solution (and precipitation of the second phase), on the other hand. As a result, a certain steady-state concentration of the second component c ss appears in a binary solid solution during HPT. This concentration is equifinal, it depends only on the HPT conditions, but not on the initial state of the binary alloy. In copper-silver alloys subjected to HPT at room temperature, this concentration is c ss = 5.5 wt.% Ag ( Acta Mater. 195 (2020) 184). It can be expected that a change in the HPT temperature should shift the dynamic equilibrium and change the c ss concentration. In this work, we annealed the samples of Cu − 8 wt.% Ag alloy at 790 °C, 300 h and at 500 °C, 770 h. After annealing at 790 °C almost all silver atoms were diluted in copper matrix. After annealing at 500 °C all silver atoms were in the precipitates and copper matrix was almost pure. The annealed samples were subjected to the HPT at 6 GPa, 1 rpm, 300 K and 77 K. After HPT the silver concentration c ss in the first sample decreased and in the second one increased. It turned out that the steady-state concentration c ss indeed changed with decrease of HPT temperature from 300 to 77 K. It decreased to c ss = 3.9 wt.% Ag. It means that the dynamic equilibrium between dissolution and precipitation of silver atoms is shifted, and precipitation prevails at 77 K. HPT also changes the size of silver precipitates. The big precipitates dissolve and small ones grow. Thus, the size of silver precipitates also comes from the top and from the bottom to the steady-state one (about 50 nm).

Decrease of steady-state solubility of Ag in Cu by high-pressure torsion at low temperature

Effect of High-Pressure Torsion Temperatures on the Precipitation and Properties of Cu-Cr Alloy

EFFECT OF HIGH PRESSURE TORSION ON STRUCTURE AND MECHANICAL PROPERTIES OF Al–Ca–Cu ALLOY

Formation of Silver Nano Particles in Percolative Ag‐PbTiO 3 Composite Dielectric Thin Film

Effects of pre-annealing process on microstructure and properties of the Cu-12%Ag composite wire

Effect of annealing processes on microstructure, mechanical properties and conductivity of Cu-12%Ag alloy composite-reinforced by fibers

Effect of High Temperature-High Pressure Treatment on Microstructure and Mechanical Properties of Cu-Cr Alloy

Thermodynamic Properties of Ti in Ag–Cu–Ti Alloys

The Effect of Cu:Ag Atomic Ratio on the Properties of Sputtered Cu–Ag Alloy Thin Films

Microstructure and Mechanical Properties of Al-4Mg-0.3Cu Alloy after HPT and Postdeformation Annealing

Characterization of CuAg Alloys with Low Ag Concentrations

Physical and chemical properties of Ag–Cu composite electrical contacts prepared by cold-press and sintering of silver-coated copper powder

Unexpected Ag-H bond in the predictive silver hydride phase under high pressure

Annealing effects on the microstructure, strength, and electrical resistivity in a dual-phase Cu-15 wt%Ag alloy

Influence of strain rate and Sn in solid solution on the grain refinement and crystalline defect density in severely deformed Cu

Consolidation of Cu-based amorphous alloy powders by high-pressure torsion

Effects of Short-Term Annealing on the Thermal Stability and Microstructural Evolution of Oxygen-Free Copper Processed by High-Pressure Torsion

Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper

Softening and Microstructure Evolution of Pure Copper Disks Processed by High Pressure Torsion

Effect of ARB cycles and post‐processing heat treatment temperature on shape memory properties of Cu‐Al‐Ag alloys

Effects of aging on the microstructure and properties of Cu-6%Ag alloy