A new peridynamic mixed-mode bond failure model for interface delamination and homogeneous materials fracture analysis

Heng Zhang,Xiong Zhang,Pizhong Qiao
DOI: https://doi.org/10.1016/j.cma.2021.113728
IF: 6.588
2021-06-01
Computer Methods in Applied Mechanics and Engineering
Abstract:<p><span><span>A new <a href="/topics/engineering/peridynamics">peridynamic</a><span> bond failure model is proposed for mixed-mode crack <a href="/topics/engineering/fracture-analysis">fracture analysis</a> in </span></span><a href="/topics/engineering/material-interface">material interface</a><span> and homogeneous isotropic materials, which utilize bond failure criteria presented for mixed-mode peridynamic bonds using the angle-dependent formations of critical stretch (CS) or critical <a href="/topics/engineering/flux-density">energy density</a> (CED). Then, three tests of asymmetric double cantilevered beams (ADCB), single edge-notched plate (SENP) and three-point bend (TPB) tests are investigated for model verification and application, and the numerical predicted </span></span><a href="/topics/engineering/fracture-behavior">fracture characteristics</a><span> (e.g., crack path, load–displacement curve and critical load) from the proposed model are compared to those obtained from the <a href="/topics/engineering/finite-element-method">finite element method</a> (FEM) result, theoretical solution and experimental data. The close comparisons demonstrate that the proposed peridynamic bond failure model can successfully capture mixed-mode fracture behaviors of interface and homogeneous materials fracture.</span></p>
mechanics,engineering, multidisciplinary,mathematics, interdisciplinary applications
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