Abstract:H‐BN/PMMA composites were prepared by in situ polymerization method, which resulted in favorable dispersibility of the h‐BN, enhanced thermal conductivity, mechanical properties and outstanding thermal stability. Inorganic fillers like hexagonal boron nitride (h‐BN) have the potential to enhance the thermal conductivity of polymer mixtures. However, it has been restricted due to poor dispersion of particles in polymer matrices by melt mixing process. The addition of inorganic powders into sticky prepolymer is expected to alleviate the aggregation of powders. In this paper, h‐BN/polymethyl methacrylate (PMMA) composites were prepared by in situ polymerization of methyl methacrylate (MMA) with 5 and 20 μm of h‐BN particle as fillers respectively, for even distribution of fillers with in composites. The structures and properties of composites were characterized by FT‐IR, DSC, TGA, SEM, laser thermal conductivity meter and universal electronic tester. By SEM, it can be seen that a highly uniform dispersion of h‐BN in PMMA. When the mass fraction of h‐BN is 20 wt%, the thermal conductivity of the composites is increased by 107% for 5 μm h‐BN and 189% for 20 μm h‐BN, respectively. With the mass constituting of 5 wt% h‐BN, majority of mechanical characteristics of the composite, such as tensile strength, tensile modulus, along with impact strength, are enhanced, alongside a decrease in bending strength. This work would provide a filling strategy of h‐BN into the polymer matrices to achieve uniform dispersion, and enhance both the thermoconductivity and mechanical strength of thermoplastic composites. Highlights A technique for creating h‐BN/PMMA composites using in suit redox polymerization. Ehancing the thermal conductivity of these composites is achievable through the even distribution of h‐BN flakes within the PMMA matrix. It provides a reference for the design of future h‐BN/PMMA composites with favorable the thermal conductivity which achieves a good balance between performance and cost.

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