Restraining warping of SLS sand mold via phenolic resin composites

Wenwen Liu,Pingkun Yao,Shan Yao
DOI: https://doi.org/10.1080/10426914.2024.2406778
IF: 4.7832
2024-10-05
Materials and Manufacturing Processes
Abstract:Mechanism of sand mold warping was systematically analyzed through experiments and numerical calculations. The results show that the asymmetric thermal stress is the main factor which leads to warping because of the temperature difference in the sand mold during printing. Then, composite powders with silica particle and thermosetting phenolic resin (TSPF) were developed, and they show better warping resistance below 0.15 J/mm 2 compared with those of traditional coated sand. In addition, the thermoplastic phenolic resin (TPPF) was added to further reduce the thermal stress due to its cyclic solid-liquid phase change. When the TPPF content reaches 50% or more, the warping of no longer occurs, and warping ratio is reduced by an order of magnitude. However, when the TPPF content is 100%, the sand mold warps in reverse due to the lack of supporting skeleton. This work provides a new way to restrain the warping of casting sand mold.
materials science, multidisciplinary,engineering, manufacturing
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