Effect of diamond grain size on mechanical properties and cutting performance of PCD tool in milling of C f /SiC composites

Cong Peng,Guolong Zhao,Xinbin Song,Zhiwen Nian,Liang Li
DOI: https://doi.org/10.1016/j.mtcomm.2024.111175
IF: 3.8
2024-12-06
Materials Today Communications
Abstract:The polycrystalline diamond (PCD) tools have excellent cutting performance in machining composites. However, the tool wear mechanism of PCD tools in milling C f /SiC composites remains unclear. There are few researches on the effect of diamond grain size on the cutting performance of PCD tools and material removal mechanism. In this paper, four PCD samples with different grain sizes were prepared under high-temperature and high-pressure condition. The microstructure, flexural strength, and cutting performance of PCD samples was tested. The wear mechanism of the tools was analyzed by observing the wear morphology of the front and rear cutting surfaces of the PCD tools. The influence of diamond grain size on the cutting performance of PCD tools was investigated in terms of tool life, surface roughness and material removal mechanism. The results indicated that the highest bending strength was found in the PCD sample with the grain size of 5 μm, as the diamond grain size increased, the bending strength of the PCD tool decreased. Tool failure was caused by fiber bundles and chip dust scratching the binder and diamond grains. In the same cutting distance, due to the difference in bonding between diamonds of different grain sizes. The 2 μm∼30 μm grain size of the PCD tool wear was the slowest, 5 μm grain size of the fastest PCD tool wear. As the grain size decreased, the machined surface quality of C f /SiC composites improved. The fiber removal mechanisms employed the gradual transition from shear removal to bending removal as the grain size increased.
materials science, multidisciplinary
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