Thermal-aware virtual machine placement based on multi-objective optimization
Bo Liu,Rui Chen,Weiwei Lin,Wentai Wu,Jianpeng Lin,Keqin Li
DOI: https://doi.org/10.1007/s11227-023-05136-z
IF: 3.3
2023-03-15
The Journal of Supercomputing
Abstract:VMP (Virtual Machine Placement) is a crucial technology for energy consumption optimization of the cloud data center. Existing works mainly focus on virtual machine consolidation to increase resource utilization and reduce computing energy consumption. However, existing studies usually ignore the thermal effect that an intensive workload on IT (Information Technology) equipment can raise energy consumption by cooling systems and generate hotspots. In addition, an excessive number of virtual machine migrations increases migration costs and risks violating the SLA (Service Level Agreement) signed with users. In this paper, we present a comprehensive system model and formulate the problem as a constrained multi-objective optimization. We propose a novel thermal-aware VMP strategy to solve the problem by jointly considering virtual machines’ migration cost, energy consumption, and heat recirculation around server racks. Our strategy makes placement decisions using MOPFGA (Multi-objective algorithm based on Pathfinder Algorithm and Genetic Algorithm) that combines classic MOPFA and GA enhanced by OBL (Opposition Based Learning) for fast convergence and avoidance of local optimum. Extensive experiments based on CloudSim using real data center workload data from PlanetLab show that our algorithm overcomes the defects of the MOPFA (multi-objective pathfinder algorithm) and GA (genetic algorithm) and significantly improves the overall efficiency of a data center. Compared with several state-of-the-art algorithms, MOPFGA on average reduces virtual machine migrations by 77.52%, increases CRAC (Computer Room Air Conditioner) supply temperature by 1.24%, and reduces cooling energy consumption by 24.78% and computational energy consumption by 23.62%.
computer science, theory & methods,engineering, electrical & electronic, hardware & architecture