Fariborz Kargar,Zahra Barani,Jacob S. Lewis,Bishwajit Debnath,Ruben Salgado,Ece Aytan,Roger Lake,Alexander A. Balandin
Abstract:We investigated thermal properties of the epoxy-based composites with a high loading fraction - up to f=45 vol.% - of the randomly oriented electrically conductive graphene fillers and electrically insulating boron nitride fillers. It was found that both types of the composites revealed a distinctive thermal percolation threshold at the loading fraction f>20 vol.%. The graphene loading required for achieving the thermal percolation was substantially higher than the loading for the electrical percolation. Graphene fillers outperformed boron nitride fillers in the thermal conductivity enhancement. It was established that thermal transport in composites with the high filler loading, above the thermal percolation threshold, is dominated by heat conduction via the network of percolating fillers. Unexpectedly, we determined that the thermal transport properties of the high loading composites were influenced strongly by the cross-plane thermal conductivity of the quasi-two-dimensional fillers. The obtained results shed light on the debated mechanism of the thermal percolation, and facilitate the development of the next generation of the efficient thermal interface materials for electronic applications.
What problem does this paper attempt to address?
The problem that this paper attempts to solve is to explore the thermal conductivity and its thermal percolation threshold of epoxy - based composites containing graphene and boron nitride fillers at high filling ratios (up to \( f \approx 45 \, \text{vol.}\% \)). Specifically, the research aims to answer the following key questions:
1. **Thermal percolation threshold**: Determine the thermal percolation threshold \( f_T \) of the composites with graphene and boron nitride fillers, that is, when the filler volume fraction reaches what value, the thermal conductivity of the composite increases significantly.
2. **Thermal conductivity enhancement mechanism**: Explore the influence of different fillers (graphene and boron nitride) on the thermal conductivity of the composite, especially at high filling ratios, what are the main mechanisms of heat conduction.
3. **Influence of two - dimensional material properties**: Study how the in - plane and out - of - plane thermal conductivities of quasi - two - dimensional materials (such as graphene and boron nitride) affect the overall heat transfer performance of the composite.
4. **Verification of theoretical models**: Look for theoretical models that can accurately describe the change in the thermal conductivity of the composite at high filling ratios, and explain the differences between experimental results and theoretical predictions.
### Research background
In recent years, because graphene has an extremely high intrinsic thermal conductivity (which can reach \( 2000 \, \text{Wm}^{-1}\text{K}^{-1} \) to \( 5000 \, \text{Wm}^{-1}\text{K}^{-1} \)), many studies have focused on using it in various composites to improve thermal conductivity. However, most studies are limited to lower filling ratios (\( f \leq 10 \, \text{vol.}\% \)), and there are relatively few studies on high filling ratios, mainly because there are technical difficulties in preparing highly filled composites with uniform dispersion.
### Main findings
1. **Thermal percolation threshold**:
- For the graphene composite, the thermal percolation threshold is \( f_T \approx 30 \, \text{vol.}\% \).
- For the boron nitride composite, the thermal percolation threshold is \( f_T \approx 23 \, \text{vol.}\% \).
- These thresholds are higher than the electrical percolation threshold (for the graphene composite, the electrical percolation threshold is approximately \( f_E \approx 10 \, \text{vol.}\% \)).
2. **Thermal conductivity enhancement**:
- The maximum thermal conductivity of the graphene composite is enhanced by about 51 times (at \( f = 43 \, \text{vol.}\% \)).
- The maximum thermal conductivity of the boron nitride composite is enhanced by about 24 times (at \( f = 45 \, \text{vol.}\% \)).
- Graphene performs better than boron nitride, mainly due to its higher intrinsic thermal conductivity.
3. **Heat transfer mechanism**:
- At low filling ratios (\( f < f_T \)), heat conduction is mainly dominated by the in - plane thermal conductivity of the matrix polymer and the filler.
- At high filling ratios (\( f \geq f_T \)), heat conduction is mainly carried out through the filler network and is strongly influenced by the out - of - plane thermal conductivity of the filler and the interface thermal resistance.
4. **Theoretical model**:
- The Lewis - Nielsen model was successfully used to fit the experimental data. This model takes into account the filler shape, arrangement mode, and their direction relative to the heat flow.
- The apparent thermal conductivity of the filler extracted from the fitting is much lower than its intrinsic thermal conductivity, which indicates that the out - of - plane thermal conductivity and the interface thermal resistance play important roles at high filling ratios.
These findings not only help to understand the heat transfer behavior of two - dimensional materials in composites, but also provide theoretical basis and technical support for the development of a new generation of efficient thermal interface materials.