The gas5 gene is disrupted by a frameshift mutation within its longest open reading frame in several inbred mouse strains and maps to murine Chromosome 1

A. Muller,S. Chatterjee,A. Teresky,A. Levine

DOI: https://doi.org/10.1007/s003359900862

1998-09-01

Mammalian Genome

Abstract:

What problem does this paper attempt to address?

Fabrication of Three-dimensional Thermally Conductive Carbon Fibers/Carbon Nanotubes Network Reinforce Epoxy Composites

Shuai Cao,Tao Jiang,Shanshan Shi,Xiaofan Gui,Ying Wang,Bo Tang,Lixue Xiang,Xuming Dai,Donghai Lin,Ning Zhong,Wenge Li,Jinhong Yu,Xinfeng Wu

DOI: https://doi.org/10.1016/j.coco.2024.102205

IF: 8

2024-01-01

Composites Communications

Abstract:With the rapid development of electronic devices and digital communication, the problem of overheating emerges due to high integration, high power and high frequency. At present, it is a hot spot to construct three-dimensional thermal conductive carbon networks for heat dissipation of electronic devices. In this paper, the Epoxy/carbon fibers/carbon nanotubes (Epoxy/CFs/CNTs) composite with high thermal conductivity was manufactured by vacuum-assisted filtration and hot press method. The effects of the carbon nanotubes content on the thermal conductivity of composites were investigated. The mutual lapped CNTs and CFs formed a thermal conductive skeleton, which obviously improves the thermal performance of the composites. The results reveal that the in-plane thermal conductivity of the Epoxy/CFs/CNTs-50c composite (17.60 vol% CFs and 8.42 vol% CNTs) reaches 20.55 W/mK, about 108 times of the thermal conductivity of the Epoxy (0.19 W/mK). In addition, Epoxy/CFs/CNTs-50c has favorable thermal management properties and achieved excellent results in LED tests. The Epoxy/CFs/CNTs composites have excellent thermal conductivity and have enormous potential as advanced thermal management materials.
Improving Thermal Conductivity of Epoxy Resin by Filling Boron Nitride Nanomaterials: A Molecular Dynamics Investigation

Mingxiao Zhu,Jiacai Li,Jiming Chen,Henggao Song,Hongyu Zhang

DOI: https://doi.org/10.1016/j.commatsci.2019.04.012

IF: 3.572

2019-01-01

Computational Materials Science

Abstract:Several kinds of inorganic nanofillers especially boron nitride (BN) are introduced to improve the thermal conducting properties of epoxy resin (EP). In this work, the influence of BN nanofillers on properties of EP composites is comprehensively investigated by using molecular dynamics (MD) technique. The thermal conductivity of BN/EP composites is calculated by reverse non-equilibrium molecular dynamics (RNEMD) method, then the effects of shapes (nanoparticle, nanotube and nanosheet), volume fractions and aspect ratios of BN nanofillers on the thermal properties are explored. To further elaborate the heat-conducting mechanism of EP composites, temperature gradient distribution and phononic density of states (PDOS) are analyzed. Moreover, the effect of BN volume fractions on the thermal conductivity of the composites is investigated by RNEMD simulation and Nielsen's theoretical model. The results indicate that the improving effectiveness of different BN nanofillers is ranked as nanosheet > nanotube > nanoparticle. This research provides new ideas for improving the thermal conductivity of composites.
Charge Dynamics and Thermal Properties of Epoxy Based Micro and Nano Hybrid Composites at High Temperatures

Xiangrong Chen,Chao Dai,Zelin Hong,Muhammad Awais,Ashish Paramane,Yasuhiro Tanaka

DOI: https://doi.org/10.1002/app.50676

IF: 3

2021-01-01

Journal of Applied Polymer Science

Abstract:This paper presents the effects of the filler type and testing temperature on the charge dynamics and thermal properties of the epoxy resin. The micro-nano hybrid composites with different content of the micro and nano aluminum nitride (AlN) fillers are fabricated. The morphology of micro-nano hybrid composites is characterized. Electrical testing and thermal analysis methods are adopted to analyze its electrical and thermal performance. The results show that the space charge accumulation is suppressed and the charge decay process is facilitated in the hybrid composites. The electrical performances of the hybrid composites are enhanced by the nano-fillers. The apparent mobility and activation energy are decreased with nano-AlN fillers in the composites at the high temperature. The glass transition temperature and thermal stability of the materials is improved with the nano-AlN. A hypothetical mechanism is proposed to explain the charge carrier injection and transport of the composites at different temperatures.
Thermal conductive epoxy adhesive composites filled with carbon-based particulate fillers: a comparative study

Rajesh Kumar,Smita Mohanty,Sanjay K. Nayak

DOI: https://doi.org/10.1080/01694243.2019.1646062

IF: 2.431

2019-07-25

Journal of Adhesion Science and Technology

Abstract:In this paper, different types of carbon-based fillers such as graphite powder (GP), expanded graphite powder (EGP), expanded graphite flakes (EGF), silane treated expanded graphite flakes (EGS) and exfoliated graphene nanoplatelets (GNPs) were used at 40 wt% loading level inside epoxy resin for comparative thermal conductivity enhancement analysis. Disc-shaped epoxy adhesive composite samples were manufactured by hand layup and mechanical mixing technique. The thermal conductivity (k) of epoxy composites was measured according to ASTM E1530 standard at 60 °C by steady-state heat flow meter technique. It was enhanced to 0.96 (∼5 times), 2.50 (∼13 times) and 3.21 W/mK (∼17 times) for 40GP + 0Ep, 40EGF + 60Ep and 40EGS + 60Ep epoxy adhesive composites at 40 wt.% of filler loading level inside low conducting (k ∼ 0.194 W/mK) epoxy resin, respectively. From scanning electron microscopy, we observed the formation of the heat-conducting network through GP, EGF and EGS inside the epoxy matrix. The lap shear strength (LSS) of the epoxy adhesive joint was increased at 40 wt% of GP filler added epoxy adhesive but it decreased at 40 wt% EGF filler loading inside the epoxy resin. Introduction of EGF inside epoxy resin has influenced negative impact on TGA analysis (thermal stability) of epoxy adhesive than GP at initial stages of thermal degradation. This indicates the commercial use of these epoxy adhesives for heat dissipation application of electronic packaging industry.

materials science, multidisciplinary,engineering, chemical,mechanics
Thermal behaviour of graphene nanoplatelets and multiwalled carbon nanotubes filled-glass fibre-reinforced epoxy composites

M. A. A. Ahmad,M. J. M. Ridzuan,M. S. Abdul Majid,S. M. Sapuan,Mohd Shihabudin Ismail,Z. M. Razlan,A. B. Shahriman

DOI: https://doi.org/10.1007/s10973-024-13195-4

IF: 4.755

2024-05-12

Journal of Thermal Analysis and Calorimetry

Abstract:The effects of thermal behaviour on graphene nanoplatelets (GP) and multiwalled carbon nanotube (CN) nanofillers of glass fibre (GL)-reinforced epoxy composites were investigated. The paper aims at evaluating, through a single and hybrid carbon-based nanofiller on the thermal stability, mechanical properties, electromechanical properties at elevated temperature, and morphologies of the composites. The nanofillers were dispersed using a mechanical stirrer, Thinky mixer, and ultrasonic probe. Hand lay-up and vacuum bagging techniques were used in the manufacturing of composites. Real-time self-monitoring of the structural damage to the specimens under tensile and flexural tests was performed through electromechanical measurements. Using the GP–CN hybrid in the composite improved the adhesion between the hybrid nanofillers and matrix. The thermal properties of GP–GL, CN–GL, and GP–CN–GL hybrid composites increased with the hybrid nanofiller addition. Mechanical testing at elevated temperatures revealed a higher rate of strength degradation for the 1.5-mass% GP–CN–GL hybrid composite than for a single nanofiller composite. The GP–CN–GL hybrid composites exhibited a more pronounced nonlinear behaviour and lower resistance.

chemistry, physical, analytical,thermodynamics
Preparation and properties of carbon‐based epoxy nanocomposites: Dynamic mechanical, dielectric, and thermal properties

Rui Wang,Congzhen Xie,Bin Gou,Huasong Xu,Shoukang Luo,Jiangang Zhou,Leilei Zeng

DOI: https://doi.org/10.1002/pc.25767

IF: 5.2

2020-08-13

Polymer Composites

Abstract:New types of carbon nanomaterials, such as multiwalled carbon nanotube (MWCNT) and graphene nanoplatelet (GNP), have attracted much attention in enhancing the thermal conductivity of polymers. However, due to the high electric conductivity of carbon materials, it is difficult for carbon‐based epoxy to achieve the high thermal conductivity while obtaining desired dielectric property. In this article, using GNP and MWCNT modified by titanate coupling agent (PN‐105), a novel method for highly thermally conductive, but electrically insulating epoxy nanocomposites is reported. The experimental results show that the 4% modified MWCNTs/epoxy nanocomposite has presented a simple thermal conductivity network, which can significantly improve the thermal conductivity of epoxy resin (EP), about 6.5 times higher than pure epoxy. Co‐filled with 2% GNPs and 4% MWCNTs, the thermal conductivity of the epoxy nanocomposite is increased to 2.04 W/mK, 957% higher than pure epoxy. In addition, the dielectric constant of the composite is 9.1, which is maintained within an acceptable range. The dynamic mechanical results show that the filling of carbon materials can reduce the storage modulus and the loss factor of EP.

materials science, composites,polymer science
Hybrid network formation of silicon carbide and expanded graphene nanoplatelets in epoxy resin for thermal management

Reza Chenari,Mohammad Fasihi

DOI: https://doi.org/10.1002/pc.27982

IF: 5.2

2023-11-30

Polymer Composites

Abstract:A Schematic of increasing the GNP to extend conductive path while maintaining electrical insulation. The current study discusses the incorporation of silicon carbide (SiC) and expanded graphene nanoplatelets (GNP) hybrid filler into epoxy resin to enhance its thermal conductivity, mechanical, and electrical insulation properties. The hybrid filler was incorporated into the epoxy resin by ultrasonic‐assisted blending solution process, and the thermal, electrical, and mechanical properties of the samples were assessed. The results displayed that both SiC and GNP fillers enhance the thermal conductivity of the epoxy resin. Addition of 15.3 wt% SiC/GNP filler (15/0.3) to pure epoxy increased the thermal conductivity coefficient by over 230%. The samples maintained the electrical insulation properties with electrical conductivity (EC) less than 10−9 S/m. Both fillers reduced the breakdown voltage of the samples. Furthermore, strong filler‐matrix adhesion resulted in a significant 414% improvement in Izod impact strength. Highlights Combining SiC and GNP fillers affects the thermal and electrical properties of epoxy. SiC and GNP synergistically improved the thermal diffusivity and conductivity of epoxy. The prepared composites remained in the range of electrical insulation. The impact strength of composites enhanced more than 400% compared to epoxy.

materials science, composites,polymer science
Carbon Nanotube/Cu Nanowires/Epoxy Composite Mats with Improved Thermal and Electrical Conductivity

Yajuan Xing,Wei Cao,Wei Li,Hongyuan Chen,Miao Wang,Hanxing Wei,Dongmei Hu,Minghai Chen,Qingwen Li

DOI: https://doi.org/10.1166/jnn.2015.9677

2015-01-01

Journal of Nanoscience and Nanotechnology

Abstract:Polymer composites with carbon nanofillers have been regarded as a promising candidate for electronic package materials. The challenge for such materials is to increase the electrical and thermal conductivity of the composites. Herein, we reported an epoxy composite film with high thermal and electrical conductivity that were prepared by loading high volume fraction of well-dispersed multi-walled carbon nanotubes (MWCNTs, around 50 nm in diameter, 1-10 µm in length) and copper nanowires (Cu NWs, 60-70 nm in diameter, 1-5 µm in length) in epoxy matrix. The MWCNT-Cu NW hybrid mats were prepared by a vacuum filtration method with an optimum Cu NW content of 50 wt%. The hybrid mats was then impregnated by epoxy solution to prepare epoxy composite films. The epoxy was modified by the toughening agent to make the composite films tough and flexible. The loading fraction of MWCNTs and Cu NWs was tuned by controlling the viscosity of epoxy solution. A remarkable synergetic effect between the MWCNTs and Cu NWs in improving the electrical and thermal conductivity of epoxy composites was demonstrated. The results showed that the electrical conductivity of nanocomposites with 42.5 wt% epoxy was 1500 S/m, and the thermal conductivity was 2.83 W/m K, which was 10.1 times of the neat epoxy. Its thermal resistance was as low as 1% of the pure epoxy. And the mechanical properties of composites were also investigated. These robust and flexible nanocomposites showed prospective applications as thermal interface materials (TIMs) in the electronic industry.
Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets

Chao Xiao,Yujie Guo,Yunlu Tang,Jiwan Ding,Xian Zhang,Kang Zheng,Xingyou Tian

DOI: https://doi.org/10.1016/j.compositesb.2020.107855

2020-04-01

Abstract:The trend of miniaturization, integration and multi-function of modern electronics leads to the speedily increased power density which makes heat dissipation a crucial issue. Herein, epoxy based composites with highly enhanced through-plane thermal conductivity were successfully prepared by constructing a free-standing and vertically aligned silicon carbide nanowires (SiCw)/functionalized boron nitride nanosheets (f-BNNS) framework through modified filtration strategy. The synergetic effect between hybrid fillers ensured highly efficient channels for phonons in vertical direction that the maximum thermal conductivity reached 4.22 W/mK at a low hybrid filler loading of 21.9 vol%, increased by 1658% in comparison to that of pure epoxy. Due to the entanglement effect of SiCw/f-BNNS framework and the enhanced interface interaction by BNNS modification, the interfacial thermal resistance between filler/filler and filler/matrix were both reduced a lot compared with random dispersion method. Exceptional heat dissipation capability of the vertically orientated architecture was also demonstrated by theoretical simulation and chip encapsulation applications. In addition, the coefficient of thermal expansion of composite reached as low as 41.1 ppm/ºC, only half of the epoxy resin (83.5 ppm/ºC). This work provides a novel strategy for fabricating polymer based composites with superior through-plane thermal conductivity in thermal management applications.
Thermoanalytical Studies of High Performance Epoxy/Carbon Nanotube Composites

Xie Hongfeng,Liu Chengguo,Yuan Zuanru,Yang Hu,Wang Zhiliu,Cheng Rongshi

DOI: https://doi.org/10.3724/sp.j.1105.2008.00332

2008-01-01

Acta Polymerica Sinica

Abstract:Carbon nanotubes (CNTs) have outstanding characteristics including high mechanical properties, namely tensile strength and elastic modulus,and still remarkable flexibility, excellent thermal and electric conductivities, low percolation thresholds (loading weight at which a sharp drop in resistivity occurs) and high aspect ratios (length to diameter ratio, L/D) while the latter provides the nanotubes with additional advantage over spherical fillers to obtain high property composites. Therefore I CNTs have the potential to act as a reinforcing filler of polymer matrices. The tetraglycidyl-4,4'-diaminodiphenylmethane (TGDDM) cured with 4,4'-diaminodiphenylsulphone WDS) and filled with graphite or carbon fibers are commonly used as a polymeric matrix in high performance composites employed in the aircraft and spacecraft industries. In present paper, multi-walled carbon nanotubes (MWNTs) as a nano-filler were incorporated in the TGDDM/DDS epoxy. The thermal properties of the composites were studied by differential scanning calorimetry (DSC), dynamic thermal analysis (DMTA) and thermal gravitimetric analysis TGA). In addition, the dispersion of MWNTs in the epoxy was also investigated by scanning electron microscopy SEM). In DSC studies, Kissinger and Flynn-Wall-Ozawa (FWO) methods were used to study the nonisothermal cure kinetics of the MWNTs filled TGDDM/DDS composites at different heating rates. The activation energy (E.) of cure reactions of the MWNTs filled epoxy composites was obtained by Kissinger and FWO methods. For all composites, the E. obtained by Kissinger method was slightly less than that of FWO method. With the addition of MWNTs, the E. of the epoxy composites decreased first and then increased with the increase of the MWNTs contents. These results showed that the incorporation of carbon nanotubes accelerated the cure reaction of the TGDDM/DDS epoxy at lower MWNTs content due to the interaction between the hydroxyl groups on the surface of nanotubes and the epoxy. However, due to the high surface energy of carbon nanotubes, the viscosity of MWNTs/epoxy composites increased at higher MWNTs content. Hence, the mobility of hydroxyl groups was hindered, and the reaction energy of composites increased with increasing MWNTs contents. The influence of carbon nanotubes on the thermal stability of the epoxy was studied by TGA. It is shown that MWNTs had little influence on the thermal stability of the cured epoxy. The storage modulus and glass transition temperature of MWNTs filled TGDDM/DDS were investigated by DMTA. It is seen that the storage modulus of TGDDM/DDS system was enhanced with the increasing of MWNTs content, that is, the modulus increased 6.3% and 7.8% at 1 wt % and 5 % MWNTs content, respectively. The glass transition temperature of the epoxy slightly decreased. Furthermore, the DMTA results of MWNTs/TGDDM/DDS composites were compared with that of carbon narrofibers (CNFs)/TGDDM/DDS composites. It was shown that the interactions between CNFs and epoxy were better those between that MWNTs and epoxy. The dispersion of carbon nanotubes in the epoxy was studied by SEM. The SEM results suggest that of MWNTs had poor dispersion in the cured epoxy. However, the radii of carbon nanotubes in the epoxy were greater than those of pure nanotubes. These results show the existence of interaction between carbon nanotubes and epoxy.
Thermal and electrical conductivity of a graphene-based hybrid filler epoxy composite

A. Nouri-Borujerdi,S. Kazemi-Ranjbar

DOI: https://doi.org/10.1007/s10853-021-06272-8

IF: 4.5

2021-06-25

Journal of Materials Science

Abstract:The development of polymer-based composites with thermal transport capability has now become essential in response to the efficient thermal management required in electronic and energy conversion devices. In this work, a novel hybrid filler consisting of graphene nanoplatelet (GNP) and boron nitride microparticles (micro-BN) is used to improve the thermal conductivity of epoxy composite. The GNPs with an average lateral size of 8 µm and an average thickness of 5 nm are in the same volume range with the 1 µm size micro-BN particles. According to the results, the thermal conductivity of the composites changes abruptly with increasing micro-BN loading at fixed GNP loading, which is attributed to the formation of a percolative network through the composite. By using 20% vol. hybrid filler, the thermal conductivity of epoxy increases from 0.22 to 5.64 W/m K, which is 147% higher than the thermal conductivity of GNP composite due to the synergistic effect. Finally, as a secondary filler in the GNP epoxy composite, nano-BN is compared with the micro-BN. It is observed that for thermal conductivity enhancement, the addition of nano-BN is not as effective as micro-BN. On the other sides, unlike nano-BN, by adding of micro-BN, the electrical conductivity of GNP epoxy composite does not change significantly. It is found that for the size of the GNPs used here, 1 µm size of micro-BN is an optimized value that leads to the formation of a strong percolated network of fillers through the composite.

materials science, multidisciplinary
Thermo-Mechanical and Thermo-Electric Properties of a Carbon-Based Epoxy Resin: An Experimental, Statistical, and Numerical Investigation

Giovanni Spinelli,Rosella Guarini,Liberata Guadagno,Luigi Vertuccio,Vittorio Romano

DOI: https://doi.org/10.3390/ma17143596

2024-07-21

Abstract:Due to their remarkable intrinsic physical properties, carbon nanotubes (CNTs) can enhance mechanical properties and confer electrical and thermal conductivity to polymers currently being investigated for use in advanced applications based on thermal management. An epoxy resin filled with varying concentrations of CNTs (up to 3 wt%) was produced and experimentally characterized. The electrical percolation curve identified the following two critical filler concentrations: 0.5 wt%, which is near the electrical percolation threshold (EPT) and suitable for exploring mechanical and piezoresistive properties, and 3 wt% for investigating thermo-electric properties due to the Joule effect with applied voltages ranging from 70 V to 200 V. Near the electrical percolation threshold (EPT), the CNT concentration in epoxy composites forms a sparse, sensitive network ideal for deformation sensing due to significant changes in electrical resistance under strain. Above the EPT, a denser CNT network enhances electrical and thermal conductivity, making it suitable for Joule heating applications. Numerical models were developed using multiphysics simulation software. Once the models have been validated with experimental data, as a perfect agreement is found between numerical and experimental results, a simulation study is performed to investigate additional physical properties of the composites. Furthermore, a statistical approach based on the design of experiments (DoE) was employed to examine the influence of certain thermal parameters on the final performance of the materials. The purpose of this research is to promote the use of contemporary statistical and computational techniques alongside experimental methods to enhance understanding of materials science. New materials can be identified through these integrated approaches, or existing ones can be more thoroughly examined.
Achieving highly thermal conductivity of polymer composites by adding hybrid silver–carbon fiber fillers

Xinfeng Wu,Shanshan Shi,Bo Tang,Jin Chen,Liming Shan,Yuan Gao,Ying Wang,Tao Jiang,Kai Sun,Ke Yang,Jinhong Yu

DOI: https://doi.org/10.1016/j.coco.2022.101129

IF: 8

2022-04-01

Composites Communications

Abstract:Multi-dimensional filler networks composed of 0D Ag nanoparticles (AgNPs), 1D Ag nanowires (AgNWs) and carbon fibers (CFs) were designed and fabricated as thermally conductive fillers for epoxy matrix. The CFs were decorated with AgNPs to increase the effective thermally conductive pathways between CFs. A small quantity of AgNWs (only 3 wt%) doped into AgNPs decorated CFs mats could dramatically increase epoxy thermal conductivity. The through-plane thermal conductivity of the epoxy composites with /AgNWs networks could reach 0.76 W/(m·K), nearly 3 times of neat epoxy and more than 50% improvement compared with CF based composite without Ag, demonstrating high efficiency of thermal conductivity improvement of 0D and 1D Ag. Moreover, as vertical heat transfer, the epoxy nanocomposites reveal improved thermal management capability compared with CF based composite, showing strong potential for efficient cooling.

materials science, composites
Influence of Graphene Nano Fillers and Carbon Nano Tubes on the Mechanical and Thermal Properties of Hollow Glass Microsphere Epoxy Composites

D Kumar,Kiran Shahapurkar,C. Venkatesh,R Muruganandhan,Vineet Tirth,Chandru Manivannan,Ibrahim M. Alarifi,Manzoore Elahi M. Soudagar,Ahmed S. El-Shafay,Kumar D,Muruganandhan R

DOI: https://doi.org/10.3390/pr10010040

IF: 3.5

2021-12-27

Processes

Abstract:The present work aimed to analyze the roll of carbon nano tubes and graphene nano fillers on the mechanical and thermal characteristics of hollow glass microsphere reinforced epoxy composites. Composites with varying content of hollow glass microballoons (2, 4, 6, 8, and 10 wt %) reinforced in epoxy matrix were fabricated. Additionally, two more types of composites, one with graphene nano fillers and the other with carbon nano tube at a constant 0.5 wt %, were fabricated with varying weight percentages of hollow glass microballoons (2, 4, 6, 8, and 10%). The composites were fabricated using an open mold casting process. Composites were tested for thermal and mechanical properties. The tensile and flexural moduli were found to rise as the HGM concentration increased. Graphene-filled HGM/epoxy composites revealed the highest modulus compared with HGM/epoxy and HGM/CNT/epoxy composites. The impact strength of all composite types decreased as the HGM content increased. Neat epoxy specimens revealed low response as compared with all the composites tested. Further, the thermal conductivity of HGM/epoxy composites was lower as compared with other compositions and neat epoxy. Scanning electron microscopy was used to analyze the surface morphological behavior of the composites subjected to flexural test. It was found that HGM/G/E composites with 10% of HGM and 0.5% of graphene by weight in epoxy matrix were the optimum.

engineering, chemical
Particle packing theory guided multiscale alumina filled epoxy resin with excellent thermal and dielectric performances

Qi-Kun Feng,Chang Liu,Dong-Li Zhang,Yan-Hui Song,Kai Sun,Hai-Ping Xu,Zhi-Min Dang

DOI: https://doi.org/10.1016/j.jmat.2022.02.008

IF: 8.589

2022-02-01

Journal of Materiomics

Abstract:Particle packing theory is utilized to guide multiscale thermal conductive particles filling epoxy resin.The optimized multiscale alumina filled epoxy resin displays a remarkably improved thermal conductivity of 2.707 W·m−1·K−1.The thermal conduction paths could be effectively formed by appropriate multiscale fillers.The addition of multiscale alumina leads to the increase of dielectric constant of composites.Polymers and composites with high thermal conductivity are promising yet challenging for the growing demand of thermal management in electrical and electronic equipment. Guided by the closest packing model, a multiscale filling Al2O3 strategy was designed and incorporated with epoxy resin (EP) to form high thermal conductive composites in this work. Epoxy composites with single filler loading were also prepared. The microstructures, thermal, rheological, and dielectric characteristics of the multiscale filling Al2O3/EP composites have been investigated. Compared with single-scale Al2O3 filled epoxy based composites, it is found that the multiscale filling Al2O3/EP composites exhibit higher thermal conductivity under the same filler loading of 50 vol %, which is attributed to the efficient heat conduction paths formed by appropriate multiscale fillers. Particularly, a remarkably improved thermal conductivity of 2.707 W·m−1·K−1 was acquired in Al2O3/EP composites at filler loading of 50 vol % (5 μm Al2O3 (26.67 vol %), 30 μm Al2O3 (27.41 vol %) and 70 μm Al2O3 (45.92 vol %)), which is about 1300 % higher than that of the pure epoxy resin. In addition, the dielectric constant of the Al2O3/EP composites were significantly improved while keeping the dielectric loss almost unchanged. The finite element simulation further verified the effectiveness of improving the thermal conductivity of materials in the heat dissipation of electrical equipment. Therefore, this research provides a simple strategy for manufacturing high thermal conductive composite materials with a wide range of potential applications as packaging materials.Download : Download high-res image (358KB)Download : Download full-size image

materials science, multidisciplinary,chemistry, physical,physics, applied
Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

Yang Hu,Chao Chen,Yingfeng Wen,Zhigang Xue,Xingping Zhou,Dean Shi,Guo-Hua Hu,Xiaolin Xie

DOI: https://doi.org/10.1016/j.compscitech.2021.108760

IF: 9.1

2021-06-01

Composites Science and Technology

Abstract:Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal expansion (CTE), and high thermal conductivity, but electrical insulation properties are largely demanded in the higher power electric devices. However, micro-fillers have a positive effect on maintaining the good flowability of epoxy composites, while do not bring high thermal conductivity enhancement per unit mass. While nano-fillers with high specific surfaces offer very promising opportunities for heat-conducting network construction, but the nano-fillers dispersion is difficult to control and will cause increased viscosity and processing difficulties. Herein, we expect that the addition of small amounts of silver nanowires (AgNWs) at 0.5 vol.% into the EP/S-Al2O3 composites could largely enhance the thermal conductivity but not sacrifice their processability. Owing to the bridging effects of rigid nanowires between the main spherical particles, the thermal conductivity of the micro-nano EP/AgNWs/S-Al2O3 composites with 40 vol.% S-Al2O3 and 0.5 vol.% AgNWs exhibits a 106.5% increment comparing to that without AgNWs. The limitation of both single micro or nano-sized thermal conductive fillers can be offset by the micro-nano filler network structure. The best combination properties of the EP/AgNWs/S-Al2O3 composites can reach the high thermal conductivity (1.602 W/m·K), low viscosity (55.6 Pa.s), low CTE (37.1 ppm/°C), and high glass transition temperature (Tg, 152.1°C). These results demonstrate that adding multiscale fillers into epoxy composites may solve the tradeoff between thermal conductivity and processability performances and fit the applications in high-power density electronic devices.

materials science, composites
Tensile and conductivity properties of epoxy composites containing carbon black and graphene nanoplatelets

Aaron S Krieg,Julia A King,David C Jaszczak,Ibrahim Miskoglu,Owen P Mills,Gregory M Odegard

DOI: https://doi.org/10.1177/0021998318771460

IF: 3.191

2018-04-26

Journal of Composite Materials

Abstract:Adding conductive fillers to an insulating polymer matrix produces composites with unique properties. Varying amounts of carbon black (0.33, 0.67, and 1 wt%) and graphene nanoplatelets (5, 10, 15, and 20 wt%) were added to epoxy. In addition, a few carbon black/graphene nanoplatelet/epoxy formulations were also fabricated. The conductivity and tensile properties were determined and analyzed. The single filler composites containing 5 and 10 wt% graphene nanoplatelet and 0.33 wt% carbon black could be used for electrically insulating applications. Composites containing 15 and 20 wt% graphene nanoplatelet could be used for static dissipative applications. The following composites could be used for semi-conductive applications: 0.67 wt% carbon black/epoxy, 1 wt% carbon black/epoxy, 0.33 wt% carbon black/5 wt% graphene nanoplatelet/epoxy, and 0.33 wt% carbon black/10 wt% graphene nanoplatelet/epoxy. At the 95% confidence level, the combination of 0.33 wt% carbon black with 5 wt% graphene nanoplatelet caused the composite electrical resistivity (1/electrical conductivity) to significantly decrease from ∼10 15 ohm-cm to ∼10 4 ohm-cm. It is likely that the highly branched, high surface area carbon black is forming an electrically conductive network with graphene nanoplatelets. Concerning single filler composites, adding ≤1 wt% carbon black did not significantly lower the composite tensile strain; however, adding graphene nanoplatelet did decrease tensile strain and increase modulus. One possible application for the 10 wt% graphene nanoplatelet/epoxy composite is in Polymer Core Composite Conductors for power transmission lines, which need to be electrically insulating, have improved thermal conductivity (increased from 0.2 to 0.3 W/m-K), increased tensile modulus (increased from 2.7 to 3.3 GPa), and good tensile strength (70 MPa) and strain (3.3%).

materials science, composites
Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials

William Anderson Lee Sanchez,Chen-Yang Huang,Jian-Xun Chen,Yu-Chian Soong,Ying-Nan Chan,Kuo-Chan Chiou,Tzong-Ming Lee,Chih-Chia Cheng,Chih-Wei Chiu

DOI: https://doi.org/10.3390/polym13010147

IF: 5

2021-01-01

Polymers

Abstract:In this study, a thermal conductivity of 0.22 W·m−1·K−1 was obtained for pristine epoxy (EP), and the impact of a hybrid filler composed of two-dimensional (2D) flake-like boron nitride (BN) and zero-dimensional (0D) spherical micro-sized aluminum oxide (Al2O3) on the thermal conductivity of epoxy resin was investigated. With 80 wt.% hybrid Al2O3–BN filler contents, the thermal conductivity of the EP composite reached 1.72 W·m−1·K−1, increasing approximately 7.8-fold with respect to the pure epoxy matrix. Furthermore, different important properties for the application were analyzed, such as Fourier-transform infrared (FTIR) spectra, viscosity, morphology, coefficient of thermal expansion (CTE), glass transition temperature (Tg), decomposition temperature (Td), dielectric properties, and thermal infrared images. The obtained thermal performance is suitable for specific electronic applications such as flip-chip underfill packaging.

polymer science
Thermal Mechanical Property Enhancement with Silicon Carbide Ceramic Filled Composites for Industrial Applications

Kalinga Hapuhinna,Rajitha D. Gunaratne,Jagath Pitawala

DOI: https://doi.org/10.3390/ceramics5040052

2022-10-13

Ceramics

Abstract:Epoxy composites with glass fiber reinforcement can be found in the automotive and aerospace industries. In this study, the properties of the epoxy matrix were enhanced by processing composites filled with ceramic particles of silicon carbide (SiC). At first, SiC-filled E-glass fiber-reinforced epoxy composites/sandwich structures were processed using the hand layup technique. Next, processed composites were characterized using a tensile tester and an Izod impact tester to determine the best mixing ratio of ceramic-embedded epoxy composites. The highest mechanical properties were obtained according to ASTM D638 and D256 standards. Next, Fourier transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM), X-ray diffraction analysis (XRD), analysis of differential scanning calorimetry (DSC), and thermogravimetric analysis (TGA) were carried out respectively to find out the presence of functional groups, surface morphology, crystallographic structure, glass transition temperature (Tg) and thermal/material stability of processed composites. In the end, the study elaborates that the mechanical properties of epoxy matrix composites were improved by the addition of SiC ceramic fillers, and among processed composites, 10% SiCE composite carried the highest properties, including the Tg value of 62.8 °C, 69.87 MPa for tensile strength and 57.12 kJ m−1 for impact strength.
Effect of Al2O3 and SiC Nano-Fillers on the Mechanical Properties of Carbon Fiber-Reinforced Epoxy Hybrid Composites

S.M. Shahabaz,Prakhar Mehrotra,Hridayneel Kalita,Sathyashankara Sharma,Nithesh Naik,Dilifa Jossley Noronha,Nagaraja Shetty

DOI: https://doi.org/10.3390/jcs7040133

2023-03-27

Journal of Composites Science

Abstract:Polymeric nanocomposites are an emerging research topic, as they improve fiber-reinforced composites’ thermo-mechanical and tribological properties. Nanomaterials improve electrical and thermal conductivity and provide excellent wear and friction resistance to the polymer matrix material. In this research work, a systematic study was carried out to examine the tensile and hardness properties of a carbon fiber epoxy composite comprising nano-sized Al2O3 and SiC fillers. The study confirms that adding nano-fillers produces superior tensile and hardness properties for carbon fiber-reinforced polymer composites. The amount of filler loading ranged from 1, 1.5, 1.75, and 2% by weight of the resin for Al2O3 and 1, 1.25, 1.5, and 2% for SiC fillers. The maximum tensile strength gain of 29.54% and modulus gain of 2.42% were noted for Al2O3 filled composite at 1.75 wt.% filler loading. Likewise, enhanced strength gain of 25.75% and 1.17% in modulus gain was obtained for SiC-filled composite at 1.25 wt.% filler loading, respectively. The hardness property of nano-filled composites improved with a hardness number of 47 for nano-Al2O3 and 43 for nano-SiC, respectively, at the same filler loading.

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