Adhesion of the electrodes on diamond device surfaces

Tom Ichibha,Kenta Hongo,Isaac Motochi,Nicholas W. Makau,George O. Amolo,Ryo Maezono
DOI: https://doi.org/10.48550/arXiv.1709.03200
2017-09-11
Abstract:Appropriate candidates of the metallic sheet used for the electrodes of diamond semiconductor are investigated using computational approaches based on density functional theory (DFT). For twenty kinds of metallic elements $x$, we modeled a diamond-metal interface and evaluated its work of separation, $W_\mathrm{sep}(x)$, as a possible measure of anti-peeling strength. The appropriateness of the Ohmic contact was inferred from DOS (density of states) analysis of diamond-metal interface by looking at whether an in-gap (isolated/localized) peak disappears as well as a sufficient amount of DOS value exists around the Fermi level. Our DFT simulation confirmed that a typical electrode, Au, is not adhesive enough for power devices [$W_\mathrm{sep}(\mathrm{Au}) = 0.80$ J/m$^2$], though showing the Ohmic contact. In contrast, some transition metals were found to possess Ohmic features with much stronger adhesion than Au [e.g., $W_\mathrm{sep}(\mathrm{Cr}/\mathrm{Ti}) = 6.02/4.03$ J/m$^2$].
Materials Science
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