Abstract:Two-dimensional (2D) semiconductors such as molybdenum disulfide (MoS 2 ) have attracted tremendous interest for transistor applications. However, the fabrication of 2D transistors using traditional lithography or deposition processes often causes undesired damage and contamination to the atomically thin lattices, partially degrading the device performance and leading to large variation between devices. Here we demonstrate a highly reproducible van der Waals integration process for wafer-scale fabrication of high-performance transistors and logic circuits from monolayer MoS 2 grown by chemical vapour deposition. By designing a quartz/polydimethylsiloxane semirigid stamp and adapting a standard photolithography mask-aligner for the van der Waals integration process, our strategy ensures a uniform mechanical force and a bubble-free wrinkle-free interface during the pickup/release process, which is crucial for robust van der Waals integration over a large area. Our scalable van der Waals integration process allows damage-free integration of high-quality contacts on monolayer MoS 2 at the wafer scale and enables high-performance 2D transistors. The van-der-Waals-contacted devices display an atomically clean interface with much smaller threshold variation, higher on-current, smaller off-current, larger on/off ratio and smaller subthreshold swing than those fabricated with conventional lithography. The approach is further used to create various logic gates and circuits, including inverters with a voltage gain of up to 585, and logic OR gates, NAND gates, AND gates and half-adder circuits. This scalable van der Waals integration method may be useful for reliable integration of 2D semiconductors with mature industry technology, facilitating the technological transition of 2D semiconductor electronics.

Scalable Van der Waals Encapsulation by Inorganic Molecular Crystals (Adv. Mater. 7/2022)

Emerging van der Waals Dielectrics of Inorganic Molecular Crystals for 2D Electronics

Scalable synthesis of 2D van der Waals superlattices

Van der Waals Encapsulation by Ultra‐thin Oxide for Air‐Sensitive 2D Materials

Reliable wafer-scale integration of two-dimensional materials and metal electrodes with van der Waals contacts

Organic Semiconductor Crystal Engineering for High‐Resolution Layer‐Controlled 2D Crystal Arrays (Adv. Mater. 22/2022)

Strategy for transferring van der Waals materials and heterostructures

Highly reproducible van der Waals integration of two-dimensional electronics on the wafer scale

A wafer-scale van der Waals dielectric made from an inorganic molecular crystal film

2D Single‐Crystalline Molecular Semiconductors with Precise Layer Definition Achieved by Floating‐Coffee‐Ring‐Driven Assembly

When 2D Materials Meet Molecules: Opportunities and Challenges of Hybrid Organic/Inorganic van der Waals Heterostructures

Two-Dimensional Van Der Waals Thin Film and Device

Transformation and reconstruction towards two-dimensional atomic laminates

Towards the scalable synthesis of two-dimensional heterostructures and superlattices beyond exfoliation and restacking

Intercalation and hybrid heterostructure integration of two-dimensional atomic crystals with functional organic semiconductor molecules

2D Molecular Semiconductors: 2D Single‐Crystalline Molecular Semiconductors with Precise Layer Definition Achieved by Floating‐Coffee‐Ring‐Driven Assembly (adv. Funct. Mater. 19/2016)

Atomic-Scale Surface Engineering for Giant Thermal Transport Enhancement Across 2D/3D van der Waals Interfaces

Non-epitaxial single-crystal 2D material growth by geometric confinement

Large‐Area Artificial van der Waals "Mille‐Feuille" Superlattices

Millimeter-Sized Two-Dimensional Molecular Crystalline Semiconductors with Precisely Defined Molecular Layers via Interfacial-Interaction-Modulated Self-Assembly.

Encapsulation strategies on 2D materials for field effect transistors and photodetectors