Recyclable, Self-Healable, and Highly Malleable Poly(urethane-urea)s with Improved Thermal and Mechanical Performances
Shujuan Wang,Yingfeng Yang,Hanze Ying,Xinli Jing,Bin Wang,Yanfeng Zhang,Jianjun Cheng
DOI: https://doi.org/10.1021/acsami.0c07553
2020-07-17
Abstract:Developing recyclable, self-healable, and highly malleable thermosets is one of the keys to relieve environmental pollution and meet our increasing demand for "greener" materials. Hindered urea bonds (HUBs) have been successfully incorporated in preparing dynamic covalent networks with those desirable properties. However, one key drawback is the low thermal stability and poor mechanical performance of previously reported systems. In this work, we demonstrated that the incorporation of aromatic moiety-containing diamine-based HUBs can greatly improve the thermal and mechanical performance of the poly(urethane-urea)s (PUUs) while still maintaining the desirable recycling, self-healing, and reprocessing properties. Studies on model compounds revealed the origin of the thermal stability and demonstrated the dynamic property. The aromatic-containing diamine-based HUBs were then used to prepare a series of catalyst-free PUUs with improved thermal and mechanical properties. The dynamic HUBs significantly reduced the relaxation timescale and allowed the PUU networks to be recycled multiple times. The healed and recycled PUUs regained most of the mechanical strength and integrity of the original material. Therefore, this unique and simple approach is expected to open up new avenues to design PUUs with optimal performance for various applications.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.0c07553?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.0c07553</a>.Determination of <i>K</i><sub>eq</sub> and <i>k</i><sub>–1</sub> of monoHUB and bisHUB, dynamic exchanges of HUB-bearing polymers, characterization details, structural formula of the model compounds, <sup>1</sup>HNMR spectra, FTIR, DSC, TGA, DMA, stress–strain curves, and stress-relaxation curves (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c07553/suppl_file/am0c07553_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,nanoscience & nanotechnology