Modeling and analysis of the electromechanical behavior of surface-bonded piezoelectric actuators using finite element method

Huangchao Yu,Xiaodong Wang

DOI: https://doi.org/10.48550/arXiv.1611.02375

2016-11-08

Abstract:Piezoelectric actuators have been widely used to form a self-monitoring smart system to do Structural health monitoring (SHM). One of the most fundamental issues in using actuators is to determine the actuation effects being transferred from the actuators to the host structure. This report summaries the state of the art of modeling techniques for piezoelectric actuators and provides a numerical analysis of the static and dynamic electromechanical behavior of piezoelectric actuators surface-bonded to an elastic medium under in-plane mechanical and electric loads using finite element method. Also case study is conducted to study the effect of material properties, bonding layer and loading frequency using static and harmonic analysis of ANSYS. Finally, stresses and displacements are determined, and singularity behavior at the tips of the actuator is proved. The results indicate that material properties, bonding layers and frequency have a significant influence on the stresses transferred to the host structure.

Computational Physics

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to determine the effect of piezoelectric actuators in intelligent structures and structural health monitoring (SHM), and how these effects are transmitted to the host structure and lead to changes in the overall structural response. Specifically, the paper focuses on the following aspects:

1. **Determining the effect**: Research how the mechanical deformation generated by the piezoelectric actuator is transmitted to the host structure through the interface, and the impact of this transmission on the overall response of the host structure.
2. **Interface stress analysis**: Explore the distribution of interface stress, especially the stress singularity behavior at the tip of the actuator.
3. **Influence of material properties**: Analyze the influence of material properties (such as Young's modulus, Poisson's ratio, etc.) on the stress transmitted to the host structure.
4. **Influence of the bonding layer**: Study how the existence of the bonding layer and its properties affect the effect of the piezoelectric actuator.
5. **Influence of frequency**: Explore the influence of the loading frequency on the stress transmitted to the host structure.

To achieve the above - mentioned goals, the paper adopts the finite element method (FEM) for numerical analysis and combines ANSYS software to simulate static and dynamic electromagnetic - mechanical behaviors. Through these analyses, the paper aims to provide a comprehensive numerical study to better understand and optimize the application of piezoelectric actuators in intelligent structures.