Abstract:Investigating the diffusion behavior of binary system is crucial for understanding the solid-state diffusion in metallic joints, as it affects the interfacial reaction that forms intermetallic components (IMCs) and introduces Kirkendall voids that change the interfacial microstructures. In this study, we intuitively investigated the interfacial diffusion behavior of Copper-Zinc alloy binary interface by in situ transmission electron microscopy . Our findings revealed the interfacial diffusion of atoms, the growth processes of intermetallic phases, and the evolution of the Kirkendall voids during thermal diffusion. We observed that the Zn atoms diffuse rapidly into Cu and form the β phase at the onset of thermal diffusion at 200 °C. Additionally, with increasing temperature, Cu atoms control the diffusion and the formation of IMCs due to their higher diffusion coefficient in the β and α phases, which are 2.09±0.63×10 -16 m 2 /s at 250 °C and 3.44±0.44×10 -17 m 2 /s at 300 °C, respectively. Furthermore, we found that the interface significantly influences the interdiffusion rates of the IMCs and the formation of Kirkendall voids. The emergence of voids, which are formed at the initial defective site and the IMC layer at the temperature of 200 and 300 °C, respectively, leading to a considerable decrease in interdiffusion at the binary interface of two orders of magnitude in comparison to unaffected regions. Moreover, we revealed the evolution of Kirkendall void, involving the formation and merging of holes, as well as the gradual thinning of atomic layers during diffusion. These findings are essential for understanding the formation and evolution of IMCs and Kirkendall void in binary interfaces.

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