Abstract:As the power density and integration level of electronic devices increase, there are growing demands to improve the thermal conductivity of polymers for addressing the thermal management issues. On the basis of the ultrahigh intrinsic thermal conductivity, graphene has exhibited great potential as reinforcing fillers to develop polymer composites, but the resultant thermal conductivity of reported graphene-based composites is still limited. Here, an interconnected and highly ordered graphene framework (HOGF) composed of high-quality and horizontally aligned graphene sheets was developed by a porous film-templated assembly strategy, followed by a stress-induced orientation process and graphitization post-treatment. After embedding into the epoxy (EP), the HOGF/EP composite (24.7 vol %) exhibits a record-high in-plane thermal conductivity of 117 W m–1 K–1, equivalent to ≈616 times higher than that of neat epoxy. This thermal conductivity enhancement is mainly because the HOGF as a filler concurrently has high intrinsic thermal conductivity, relatively high density, and a highly ordered structure, constructing superefficient phonon transport paths in the epoxy matrix. Additionally, the use of our HOGF/EP as a heat dissipation plate was demonstrated, and it achieved 75% enhancement in practical thermal management performance compared to that of conventional alumina for cooling the high-power LED.The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsnano.1c01332.Typical cross-sectional SEM image of the porous PU film. Photographs, TGA curves, and SEM images of graphene/PU prepared using a bulk PU sponge as a template. Scheme and photographs of the molds used for controlling the compression ratio in the preparation process of the HOGF. Characterization analysis of the MLGs used in this study. Raman spectra of HOGF and CVD-grown graphene using nickel foil as the catalyst template. Appearance photographs and typical cross-sectional SEM images of the graphene framework/epoxy composites. Typical cross-sectional TEM images of HOGF/EP composites. TGA curves of neat epoxy and HOGF/EP composites in the nitrogen atmosphere. Typical SEM and TEM images of dispersed graphene/EP composite. Schematic of the ANSYS simulation models and the calculated results for the HOGF/EP and dispersed graphene/EP modules. Scheme illustrating the comparison of the transient heat transfer capacity along the in-plane direction of HOGF/EP, dispersed graphene/EP, and zinc. Environmental temperature-dependent specific heat capacity and thermal diffusivity of neat epoxy and HOGF/EP composite. Schematic of the Icepak simulation models and the calculated results with the alumina and HOGF/EP as the heat dissipation plate. TMA curves and CTE of neat epoxy and graphene framework/epoxy composites. The parameters for the calculation of thermal conductivities of neat epoxy and the HOGF/EP composites. The parameters for the calculation of thermal conductivities of dispersed graphene/EP composites. The key parameters for calculating the ⟨cos2 θ⟩ and orientation parameter (f). Comparison of thermal conductivities of our HOGF/EP composites with reported graphene/polymer composites. The detailed parameters of the components in the simulated system (PDF)This article has not yet been cited by other publications.

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