Abstract:Flexible electronics has gained increased traction in a number of applications for closer integration of form and function. Further research in 3D printing is needed to bridge the gap between connecting SMD components on additively printed circuits and replacing conventional rigid boards due to the increased need for FHE. Different research and technology to build interconnections between printed traces and surface mounting devices are presently being studied (SMD). It is crucial to develop the way passive components are connected to a flexible substrate and to create a reliable connection to replace traditional rigid boards with flexible electronics. In FHE, there is quite some literature available with printed silver traces and various component attachment materials. With the growing demand for silver in Flexible Hybrid Electronics (FHE), it is critical to comprehend the effect of the binding material on the performance of the connected component. To understand the behavior of the binding materials, we employed several binding materials such as low-temperature solder (LTS) and electrically conductive adhesive (ECA) in conjunction with various active and passive components in this study. We tested the components before and after attachment to have a better knowledge of the component attachment performance characteristics. We also examine the intermetallic development at the cross-section using a scanning electron microscope (SEM) with Energy Dispersive X-ray analysis (EDX). The Shear Test (Mechanical Property) of the attached components has also been presented for the various applications to establish a reliable application-based material selection. We have used OrCAD software to build and analyze an inverting OpAmp circuit to simulate applications.

Automating Open Fault Correction in Integrated Circuits via Field Induced Diffusion Limited Aggregation

Computational Analysis of Mechanical and Electromigration Reliability Problems

Electrothermal-Stress Interactions of LDMOS FET Induced by DCI RF-Pulses

Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

Numerical simulation of electromigration failure in IC interconnect structures

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

Theoretical Understanding of Electromigration-Related Surface Diffusion and Current-Induced Force in Ag–Pd Systems

On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs

Fault Injection and Failure Analysis on Xilinx 16nm FinFET Ultrascale+ MPSoC

Atomic Defect-Aware Physical Design of Silicon Dangling Bond Logic on the H-Si(100)2x1 Surface

Study of Migration and Coalescence of Voids Driven by Electric Current Stressing in Solder Interconnects Using Phase Field Simulation

A Study of Critical Area Extration for Soft Fault of Opens

Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds

Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits

Simulation-Guided Analysis towards Trench Depth Optimization for Enhanced Flexibility in Stretch-Free, Shape-Induced Interconnects for Flexible Electronics

Combining Circuit Level and System Level Techniques for Defect-Tolerant Nanoscale Architectures

On Utilizing Alternating Current-Flow Field Effect Transistor for Flexibly Manipulating Particles in Microfluidics and Nanofluidics

Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits

Atomistic study of shearing mechanism of nano-Ag joints and processing parameter optimization

Electromigration Simulation for Metal Lines

Fabricating Atom-Sized Gaps by Field-Aided Atom Migration in Nanoscale Junctions