92‐2: What Type of MicroLED: Flip Chip, Vertical, or Lateral?

Reza Chaji,Kevin Cheng,Hossein Zamani

DOI: https://doi.org/10.1002/sdtp.17782

2024-06-01

SID Symposium Digest of Technical Papers

Abstract:MicroLED displays can enable new manufacturing processes where the race to larger substrates is not required, and it can be produced at different places, e.g. OEMs, vendors, hardware developers leading to the distributed supply chain.

What problem does this paper attempt to address?

37‐1: Invited Paper: Manufacturing Readiness of High‐Efficiency and Low‐Cost MicroLED Displays

Mingwei Zhu,Hou T Ng,Sivapackia Ganapathiappan,Zhiyong Li,Nag Patibandla

DOI: https://doi.org/10.1002/sdtp.16609

2023-06-01

SID Symposium Digest of Technical Papers

Abstract:Applied Materials is pursuing an innovative and manufacturing scalable approach to fabricate full‐color microLED displays on active‐matrix TFT backplanes with four subpixels, high‐efficiency UV‐A microLEDs and in‐situ curing of Cd‐free R/G/B QD formulations. A simplified die‐transfer and much reduced die repair scheme using the 4th subpixel are developed and demonstrated. The readiness of manufacturing tools, materials and processes, and the development of microLEDs with size down to 6μm will be discussed along with progress in assembling smartwatch size displays of superior performance.
84‐4: Transfer of Flip‐Chip Structure micro‐LED from Sapphire to Thin Film

Jiayi Li,Zhaojun Liu

DOI: https://doi.org/10.1002/sdtp.17750

2024-06-01

SID Symposium Digest of Technical Papers

Abstract:Micro‐LED has become a hotspot in the field of displays due to its advantages such as high brightness and self‐emission, and is regarded as the next‐generation display technology. Mass transfer of micro‐LED refers to the process of transferring a large number of chips from grown substrate to another carrier, which is one of the important methods to achieve full‐color display of micro‐LED, and how to achieve high yield and high speed in mass transfer has always been a focus of attention. In this paper, mass transfer process of micro‐LEDs is studied, wherein laser lift‐off technology is employed to separate the LEDs from the sapphire substrate. Taking advantage of adhesive differences in the film, the micro‐LED array is flipped twice to complete the mass transfer process.
21‐1: Invited Paper: Technology Trend and Challenges for MicroLED Large Display Applications

Hsu Chen-Ke

DOI: https://doi.org/10.1002/sdtp.16543

2023-06-01

SID Symposium Digest of Technical Papers

Abstract:MicroLED is good technology for fine pitch (<P1.0) large display applications. From the TV and LED display history trend, people like larger display and better picture quality for immersion illusion. MiniLED COB become the main trend from year 2019, and next coming MicroLED technology is obviously direction. Sony already has CLEDIS in B and C series in the market. Samsung announced that MicroLED COG Display in 89", 101" and 114" in 2023 CES. This talk will be focus on MicroLED technologies for fine pitch large display. POB, POG and COG are technologies for different driving platform and their own advantages. MiP (MicroLED in Package) technology demonstrates advantages for fine pitch large display application.
The micro-LED roadmap: Status quo and prospects

Chien-chung Lin,Yuh-Renn Wu,Hao-Chung Kuo,Matthew S. Wong,Steven P. DenBaars,Shuji Nakamura,Ayush Pandey,Zetian Mi,Pengfei Tian,Kazuhiro Ohkawa,Daisuke Iida,Tao Wang,Yuefei Cai,J Bai,Zhiyong Yang,Yizhou Qian,Shin-Tson Wu,Jung Han,Chen Chen,Zhaojun Liu,Byung-Ryool Hyun,Jae-Hyun Kim,Bongkyun Jang,Hyeon-Don Kim,Hak-Joo Lee,Ying-Tsang Liu,Yu-Hung Lai,Yun-Li Li,Wanqing Meng,Haoliang Shen,Bin Liu,Xinran Wang,Kai-ling Liang,Cheng-Jhih Luo,Yen-Hsiang Fang

DOI: https://doi.org/10.1088/2515-7647/acf972

2023-09-15

Journal of Physics Photonics

Abstract:Micro LED can play an important role in the future generation of smart displays. They are found very attractive in many applications, such as maskless lithography, biosensor, AR/MR etc., at the same time. A monitor that can fulfill saturated color rendering, high display resolution, and fast response time is highly desirable, and the micro LED-based technology could be our best chance to meet these requirements. At present, semiconductor-based RGB micro LED chips and color-conversion enhanced Micro LEDs are the major contenders for the full-color high resolution displays. Both of the methods need revolutionary ways to perfect the material qualities, fabricate the device, assemble the individual parts into a system. In this roadmap, we will highlight the current status and challenges of the micro LED-related issues, and discuss the possible advances in science and technology that can stand up to the challenges. The innovation in epitaxy, such as the tunnel junction, the direct epitaxy and nitride based quantum wells for red and ultraviolet, can provide critical solutions of the micro LED performance in various aspects. The quantum scale structure like nanowire or nanorod can be crucial for the scaling of the devices. Meanwhile, the color conversion method, which uses colloidal quantum dots as the active material, can provide a hassle-free way to assemble a large micro LED array, and emphasis on the full color demonstration via colloidal quantum dots. These quantum dots can be patterned by porous structure, inkjet or photo-sensitive resin. In addition to the micro LED devices, the peripheral components or technologies are equally important. Microchip transfer and repair, heterogeneous integration with the electronics and the novel 2D material cannot be ignored or the overall display module will be very power-consuming. The augmented reality is one of the potential customer for our micro-LED displays and the user experience so far is limited due to lack of the truly qualified display. Our analysis showed the micro LED is on the way to address and solve the current problems, such as high loss optical coupling and narrow field of view. All these efforts are channeled to achieve an efficient display with all ideal qualities that meet our most stringent viewing requirements and expect it to become an indispensable part of our daily life.
Mass transfer for Micro-LED display: Transfer printing techniques

Changhong Linghu,Shun Zhang,Chengjun Wang,Hongyu Luo,Jizhou Song

DOI: https://doi.org/10.1016/bs.semsem.2020.12.002

2021-01-01

Abstract:Micro-LED display, which is regarded as the next-generation display technology, has obtained immense attention and great development during the past 2 decades. Mass transfer is the key step for the assembly of Micro-LED displays, which require the integration of Micro-LED chips from the fabrication wafers onto the display panel. Transfer printing is an emerging deterministic assembly technique and provides a versatile solution with great promise for mass transfer. Here, we firstly reviewed and compared the existing mass transfer techniques and then provided a brief review on the basic principles, typical protocols and the latest development of transfer printing techniques.
Vertical full-colour micro-LEDs via 2D materials-based layer transfer

Jiho Shin,Hyunseok Kim,Suresh Sundaram,Junseok Jeong,Bo-In Park,Celesta S. Chang,Joonghoon Choi,Taemin Kim,Mayuran Saravanapavanantham,Kuangye Lu,Sungkyu Kim,Jun Min Suh,Ki Seok Kim,Min-Kyu Song,Yunpeng Liu,Kuan Qiao,Jae Hwan Kim,Yeongin Kim,Ji-Hoon Kang,Jekyung Kim,Doeon Lee,Jaeyong Lee,Justin S. Kim,Han Eol Lee,Hanwool Yeon,Hyun S. Kum,Sang-Hoon Bae,Vladimir Bulovic,Ki Jun Yu,Kyusang Lee,Kwanghun Chung,Young Joon Hong,Abdallah Ougazzaden,Jeehwan Kim

DOI: https://doi.org/10.1038/s41586-022-05612-1

IF: 64.8

2023-02-02

Nature

Abstract:Micro-LEDs (μLEDs) have been explored for augmented and virtual reality display applications that require extremely high pixels per inch and luminance 1,2 . However, conventional manufacturing processes based on the lateral assembly of red, green and blue (RGB) μLEDs have limitations in enhancing pixel density 3,4,5,6 . Recent demonstrations of vertical μLED displays have attempted to address this issue by stacking freestanding RGB LED membranes and fabricating top-down 7,8,9,10,11,12,13,14 , but minimization of the lateral dimensions of stacked μLEDs has been difficult. Here we report full-colour, vertically stacked μLEDs that achieve, to our knowledge, the highest array density (5,100 pixels per inch) and the smallest size (4 μm) reported to date. This is enabled by a two-dimensional materials-based layer transfer technique 15,16,17,18 that allows the growth of RGB LEDs of near-submicron thickness on two-dimensional material-coated substrates via remote or van der Waals epitaxy, mechanical release and stacking of LEDs, followed by top-down fabrication. The smallest-ever stack height of around 9 μm is the key enabler for record high μLED array density. We also demonstrate vertical integration of blue μLEDs with silicon membrane transistors for active matrix operation. These results establish routes to creating full-colour μLED displays for augmented and virtual reality, while also offering a generalizable platform for broader classes of three-dimensional integrated devices.

multidisciplinary sciences
Super retina TFT based full color microLED display via laser mass transfer

Xu Yang,Jinchai Li,Xuhui Peng,Chunfeng Zhao,Chao Chen,Xiaowei Zhang,Jinliang Lin,Donghua Li,Yuefen Chen,Zhaoxia Bi,Feng Qin,Cheng Li,Kai Huang,Junyong Kang,Rong Zhang

DOI: https://doi.org/10.1007/s11432-024-4111-9

2024-10-22

Science China Information Sciences

Abstract:MicroLED display is considered one of the most promising technologies for next-generation displays. However, the high manufacturing cost has been a major obstacle to its accessibility to the general consumer market, and mass transfer, an essential process to achieve cost-effective manufacturing, has not yet reached commercial maturity. Critical issues, such as microLED chips, transfer equipments, and process materials, need to be addressed for the mass transfer technologies. In this work, we present a 1.63-inch full color microLED display module fabricated with laser mass transfer, which has a pixel density of 403 pixels per inch (PPI), the highest resolution ever achieved in the industry using mass transfer technologies. The laser mass transfer is realized with three process nodes: laser lift-off, laser induced forward transfer, and carrier bonding. Each node has been well explored to improve yields. Insights into the present progress and the future development of the laser mass transfer will be shared in this work.

computer science, information systems,engineering, electrical & electronic
The scaling of the microLED and the advantage of 2D materials

Xuejun Xie,Hamid T. Chorsi,Kunjesh Agashiwala,Hsun-Ming Chang,Jiahao Kang,Jae Hwan Chu,Ibrahim Sarpkaya,Han Htoon,Jon A. Schuller,Kaustav Banerjee

DOI: https://doi.org/10.48550/arXiv.2101.10077

2021-01-19

Abstract:The demand for higher resolution displays drives the demand for smaller pixels. Displays show a trend of doubling the pixel number every 4 years and doubling the pixel per inch (PPI) every 6 years. As the prospective candidate for next-generation display technology, microLED (micro Light Emitting Diode) will suffer from sidewall current leakage and poor extraction efficiency as its lateral size reduces. Using Finite Element Analysis (FEA) method and Finite-Difference Time-Domain (FDTD) method, we find that reducing the thickness of the LED can reduce the current leaking to the sidewalls and reduce the total internal reflection simultaneously. A promising solution to this problem is by using atomically thin 2D materials to make LEDs. However, monolayer inorganic 2D materials that can provide red, green and blue emission are still lacking. Based on the blue light-emitting material fluorographene (CF), partially fluorinated graphene (CFx) is synthesized in this work to emit red and green colors from 683 nm to 555 nm (limited by the instrument). This work also demonstrates lithographically defined regions with different colors, paving the way for the scaling of microLED.

Applied Physics,Computational Physics,Optics
High-Density Integration of Ultrabright OLEDs on a Miniaturized Needle-Shaped CMOS Backplane

Sabina Hillebrandt,Chang-Ki Moon,Adriaan J Taal,Henry Overhauser,Kenneth L Shepard,Malte C Gather

DOI: https://doi.org/10.1002/adma.202300578

Abstract:Direct deposition of organic light-emitting diodes (OLEDs) on silicon-based complementary metal-oxide-semiconductor (CMOS) chips has enabled self-emissive microdisplays with high resolution and fill-factor. Emerging applications of OLEDs in augmented and virtual reality (AR/VR) displays and in biomedical applications, e.g., as brain implants for cell-specific light delivery in optogenetics, require light intensities orders of magnitude above those found in traditional displays. Further requirements often include a microscopic device footprint, a specific shape and ultrastable passivation, e.g., to ensure biocompatibility and minimal invasiveness of OLED-based implants. In this work, up to 1024 ultrabright, microscopic OLEDs are deposited directly on needle-shaped CMOS chips. Transmission electron microscopy and energy-dispersive X-ray spectroscopy are performed on the foundry-provided aluminum contact pads of the CMOS chips to guide a systematic optimization of the contacts. Plasma treatment and implementation of silver interlayers lead to ohmic contact conditions and thus facilitate direct vacuum deposition of orange- and blue-emitting OLED stacks leading to micrometer-sized pixels on the chips. The electronics in each needle allow each pixel to switch individually. The OLED pixels generate a mean optical power density of 0.25 mW mm-2, corresponding to >40 000 cd m-2, well above the requirement for daylight AR applications and optogenetic single-unit activation in the brain.
Wafer-Level Monolithic Integration of Vertical Micro-LEDs on Glass

W. Guo,T. Sun,Yanzhao Li,Hu Meng,Youru Chen

DOI: https://doi.org/10.1109/LPT.2020.2991672

IF: 2.6

2020-05-06

IEEE Photonics Technology Letters

Abstract:In an earlier study micro-LED micro display (< 1 inch) on silicon CMOS backplane was demonstrated for augmented reality (AR) applications. Here we report the feasibility of wafer-level monolithic integration of micro-LEDs on glass substrate/backplane. Such issues as the cracking of GaN epitaxial layer, the deviation of alignment, and the peeling of insulator are discussed. SU-8 is proposed as the insulator material in vertical micro-LEDs, resulting into improved light extraction efficiency and allowing for the reduced light crosstalk between sub pixels if the integrated reflective mirrors are used. A directly driven micro-LED parallel array with a resolution of <inline-formula> <tex-math notation="LaTeX">${320}\times {720}$ </tex-math></inline-formula> with individual LED size ranging from 5 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> to 28 <inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> is demonstrated. It is believed that this monolithic technology on glass will play an important role in future high performance and low cost wearable and/or phone displays.

Engineering,Materials Science,Physics
Monolithically Integrated μ LEDs/HEMTs Microdisplay on a Single Chip by a Direct Epitaxial Approach

Yuefei Cai,Chenqi Zhu,Wei Zhong,Peng Feng,Sheng Jiang,Tao Wang

DOI: https://doi.org/10.1002/admt.202100214

IF: 6.8

2021-05-04

Advanced Materials Technologies

Abstract:There is a significantly increasing demand on developing a microLED (μLED) based microdisplay which may be the only display system that can meet the requirements for augmented reality/virtual reality systems, helmet mounted displays, and head‐up displays. However, a number of fundamental challenges which cannot be met by any existing technologies need to be overcome before such a microdisplay with satisfied performance becomes possible. In this paper, a different type of integration concept using an epitaxial approach is proposed, aiming to monolithically integrate μLEDs and high electron mobility transistors (HEMTs) on a single chip. This concept can be potentially realized by using a selective epitaxial overgrowth method on a predefined HEMT template featuring microhole masks. Finally, the proposed epitaxial integration concept is translated into a prototype, demonstrating an 8 × 8 microLED microdisplay, where each μLED is electrically driven by an individual HEMT which surrounds its respective μLED via the gate bias of the HEMT.

materials science, multidisciplinary
Challenges of high-yield manufacture in micro-light-emitting diodes displays: chip fabrication, mass transfer, and detection

Binhai Yu,Yong Li,Jiasheng Li,Xinrui Ding,Zongtao Li

DOI: https://doi.org/10.1088/1361-6463/ad6ce3

2024-08-31

Journal of Physics D Applied Physics

Abstract:Micro-light-emitting diode (micro-LED) is a promising display technology that offers significant advantages, including superior brightness, resolution, contrast, energy consumption, and response speed. It is widely recognized as the next generation of display technology with broad application prospects. However, in the manufacturing process of micro-LED displays, producing high-quality and defect-free micro-LED chips and achieving non-destructive processing throughout the long manufacturing chain pose significant difficulties, causing the low production yield of micro-LED displays and extremely limiting their commercialization. This paper provides an overview of high-yield manufacture of micro-LED displays, targeted to improve the production yield during three key manufacturing processes: chip fabrication, mass transfer, and detection. The factors causing chip defects and key technologies for reducing chip defects in these three manufacturing processes, which are closely related to the production yield of micro-LED displays manufacturing, are discussed. Lastly, the future prospects of micro-LED display technology are highlighted.

physics, applied
91‐1: Invited Paper: Micro‐LED Stamp Transfer & Repair Technology for Tiling Display

Yan Wang,Yongxin Cui,Jiye Xia,Xuan Cao

DOI: https://doi.org/10.1002/sdtp.17776

2024-06-01

SID Symposium Digest of Technical Papers

Abstract:Micro‐LED technology is believed to be the next generation of display, which has attracted increasing interests from academia and display industry. Combined with the efforts of of panel makers, LED manufacturers, equipment and materials makers, the yield and performance of Micro‐LED is becoming more competitive over that of a few years ago. Stamp transfer is still the closest mass transfer technology towards the possibility of mass production of Micro‐LED. Along with more mature inspection and repair, slicing, driving and demura technology, Vistar has developed a full‐process solution for the fabrication of 102 inch large area splicing display, constructed with 4.78 inch Micro‐LED display modules. After the construction of the first Micro‐LED pilot line in Mainland China in Aug 2020, Vistar took another leap in the construction of the first Micro‐LED mass production line, which laid foundation in Sep 2023. It is a big step closer to a future of Micro‐LED filled with displays.
A review of key technologies for epitaxy and chip process of micro light-emitting diodes in display application

Pan Zuo-Jian,Chen Zhi-Zhong,Jiao Fei,Zhan Jing-Lin,Chen Yi-Yong,Chen Yi-Fan,Nie Jing-Xin,Zhao Tong-Yang,Deng Chu-Han,Kang Xiang-Ning,Li Shun-Feng,Wang Qi,Zhang Guo-Yi,Shen Bo

DOI: https://doi.org/10.7498/aps.69.20200742

IF: 0.906

2020-01-01

Acta Physica Sinica

Abstract:The continuous miniaturization and integration of pixelated devices have become a main trend in the field of display. Micro light-emitting diode (micro-LED) display is composed of an array of LEDs that are sub-50-micrometers in length. It has huge advantages in brightness, resolution, contrast, power consumption, lifetime, response speed and reliability compared with liquid crystal display (LCD) and organic LED (OLED) display. Consequently, micro-LED display is regarded as the next-generation display technology with high potential applications, such as virtual reality (VR), augmented reality (AR), mobile phones, tablet computers, high-definition TVs and wearable devices. Currently, the combination of commercial 5G communication technology with VR/AR display, ultra high definition video technologies will further prompt the development of micro-LED display industry. However, some basic scientific and technological problems in micro-LED display remain to be resolved. As the chip size shrinks to below 50 mu m, some problems that are not serious for large-sized LEDs appear for micro-LEDs. These problems include crystalline defects, wavelength uniformity, full-color emmision, massively tranferring and testing, etc. In the past two decades, various solutions to those problems have been proposed, which have greatly promoted the progress of micro-LED display. In this paper, an overview of micro-LED display since 2000 is given firstly, which includes the main research results and application achievements. Secondly the issues involved in the wafer epitaxy and chip process of micro-LEDs and possible solutions are discussed based on the display application in detail. The surface state induced by the dangling bonds and dry etching damages are concerned for the nonradiative recombination at a low injection level. The remedies are provided for those surface states, such as atomic-layer deposition and neutral beam etching. Some methods to reduce the threading dislocation and suppress the polarization field are summarized for micro-LED epitaxial growth. Moreover, the GaN-based LEDs on Si (100) substrate are also introduced for the future integration of micro-LEDs into the Si-based integrated circuits. As to the wavelength uniformity, the MOCVD equipment and growth technology including the laser treatment are discussed. In the chip processing part, the full-color display, mass transfer and effective inspection technology are discussed. Assembling RGB individual LEDs, quantum dot phosphor material and nanocoloumn LEDs are different routes for full-color display. Their trends in the future are provided. The pick and place, laser lift-off technologies, are strengthened in the massively transferring for micro-LEDs. In the massively and rapidly inspection technologies, the photoluminscence combined with Raman scattering, the electroluminescence combined with digital camera are discussed. Finally, the summary and outlook in these issues are also provided.
24.1: Invited Paper: Micro‐LED 4.78 inch Tiled Display Modules with 100% Yield Achieved by Stamp Transfer Technology

Xuan Cao,Yan Wang,Kang Wang,Jie Lin,Yongxin Cui,Xiuqi Huang

DOI: https://doi.org/10.1002/sdtp.16254

2023-04-01

SID Symposium Digest of Technical Papers

Abstract:Glass based Micro‐LED display, as one of the most promising advanced display technologies, has attracted increasing interests from academia and display industry. With collaborative work by panel makers, LED manufacturers, equipment and materials makers in the efforts to improve the yield and performance while reducing the cost, Micro‐LED is getting closer towards a possibility of mass production full‐process. Stamp mass transfer is the pioneer candidate along this roadmap. With extensive research in transfer, inspection and repair technology, Vistar has developed a full‐ process solution that can push the yield up to 100% on our splicing display units. In this paper, we introduce the 4.78 inch true bezel‐ less Micro‐LED panel, as building blocks towards free size large tiled displays. And by proofing the technology in Micro‐LED manufacture, this may lay out a milestone in the way towards the realization of industrial Micro‐LED products.
Research Progress of Micro-LED Display Technology

Shenghao Zhang,Hua Zheng,Lv Zhou,Huadan Li,Yuanrui Chen,Chenchen Wei,Tao Wu,Wei Lv,Geng Zhang,Shaoqiang Zhang,Zheng Gong,Baohua Jia,Han Lin,Zhiwen Gao,Wei Xu,Honglong Ning

DOI: https://doi.org/10.3390/cryst13071001

IF: 2.7

2023-06-23

Crystals

Abstract:Micro-LED display technology is considered to be the next generation of display technology, which has the characteristics of high miniaturization, thin film and integration, as well as the advantages of high brightness, high contrast, fast response speed and long service life. However, in the development of Micro-LED display technology, there are still some technical and cost problems to be solved. This paper focuses on the key technologies involved in Micro-LED display technology, such as chip technology, mass transfer, full-color display, bonding and driving technology, the research history and frontier progress of these technologies are reviewed in detail. For chip epitaxy technology, the wavelength uniformity, current density and defect control are emphasized; for chip process, the two main chip structures and the challenges brought by miniaturization are discussed emphatically; for chip integration, full-color display, backplane bonding and driving, several mainstream technical schemes are summarized in turn. Finally, the chip detection and repair technologies and commercial application are introduced.

materials science, multidisciplinary,crystallography
Advanced Manufacturing of Microscale Light-Emitting Diodes and Their Use in Displays and Biomedicine

Junyu Chen,He Ding,Xing Sheng

DOI: https://doi.org/10.1080/15980316.2023.2248403

2023-01-01

Journal of Information Display

Abstract:Thin-film, microscale light-emitting diodes (micro-LEDs)-based III–V compound semiconductors are emerging as a promising technology for next-generation light sources with various applications including lighting, display and biomedicine. With this perspective, we provide an overview and highlight our own progress on the recent developments in advanced manufacturing techniques and potential applications of micro-LEDs. The combination of epitaxial lift-off and transfer printing techniques have produced ultraminiaturized, highly luminous, and energy-efficient thin-film micro-LEDs, with a wide range of applications. To achieve full-color displays, several approaches have been developed, including horizontally and vertically assembled red-green–blue (RGB) pixels, and quantum dot conversion. For neuroscience studies, these micro-LEDs can be integrated in flexible probes as implantable light sources, which facilitate light delivery into the deep brain tissue for optogenetic stimulations and biological sensing. Additionally, micro-LEDs have the potential to function as wireless biosensors to detect changes in the biological environment, through their luminescence or in combination with other devices. Overall, advanced manufacturing techniques produce micro-LEDs that promise significant applications not only in displays but also in various biomedical fields.
Towards Micro-Peled Displays

Xiaoyu Yang,Li Ma,Lei Li,Mi Luo,Xing Wang,Qihuang Gong,Changjun Lu,Rui Zhu

DOI: https://doi.org/10.1038/s41578-022-00522-0

IF: 83.5

2023-01-01

Nature Reviews Materials

Abstract:The miniaturization of conventional light-emitting diodes (LEDs) is a growing trend for emerging virtual and augmented reality and ultrahigh-resolution display applications. However, at present, the downscaling and integration of group III–V LED chips face great challenges, including efficiency droop, inhomogeneous emissions and side-wall losses upon top-down etching and mass-transfer processing. Perovskite LEDs (PeLEDs) are a promising alternative candidate for displays. Within a decade, they have achieved competitive performance owing to their narrowband emission, wide colour gamut and facile fabrication protocols. In particular, solution-processed perovskite emitting layers can be arranged into microscale pixels using various patterning techniques and show great potential for the development of advanced microscale PeLED (micro-PeLED) devices. In this Perspective article, we summarize the recent progress in perovskite patterning techniques and in the fabrication of micro-PeLED demos. We also share our viewpoint regarding the unique advantages of hybrid perovskites for microscale and nanoscale miniaturization, and we conclude by discussing the future challenges and technical roadmap for the development of micro-PeLED displays.
Transfer of Micro‐LEDs with Roll‐Based Direct Overlay Alignment for Manufacturing Transparent Displays

Sung‐Uk Yoon,Yun Hwangbo,Bongkyun Jang,Hyeon‐Don Kim,Jae‐Hyun Kim

DOI: https://doi.org/10.1002/aelm.202400236

IF: 6.2

2024-06-08

Advanced Electronic Materials

Abstract:The study has developed a roll‐to‐plate (R2P) transfer technique with overlay alignment capabilities, where gradual positional errors are analyzed during micro‐LED transfer and present a straightforward solution. As a demonstration, micro‐LEDs are successfully transferred to a transparent circuit board (TCB), achieving a transparent display with 72.5% transparency. Transparent displays are crucial for various applications, particularly for their potential use as windows in future self‐driving cars. These displays require high transparency, low power consumption, and high mechanical reliability. Micro‐LEDs have emerged as ideal devices for the transparent displays. Efficient mass‐production processes are essential for the commercialization of transparent micro‐LED displays. This study presents roll‐based mass transfer to enhance the productivity of transparent micro‐LED displays. Roll transfer processes traditionally face resolution challenges in alignment repeatability and positional errors in both the transverse direction (TD) and machine direction (MD). This study proposes a roll‐to‐plate (R2P) transfer process with overlay alignment to improve the repeatability precision of the alignment. Detailed experimental analyses address positional errors in the TD and MD, attributed to initial contact errors and linear velocity asynchrony, respectively. The results demonstrate successful micro‐LED transfer onto a transparent circuit board (TCB) with a maximum positional error of 3.2 μm and a 99.75% yield. The resulting micro‐LED display achieves a transparency of 72.5% with 68 pixels per inch. This study overcomes the alignment challenges in the R2P process and contributes to the commercialization of transparent micro‐LED displays. It is expected to positively impact the manufacturing of transparent applications that involve rolling processes.

materials science, multidisciplinary,nanoscience & nanotechnology,physics, applied
High-yield Micro-LED laser transfer accomplished using an ablation-type release material

Yujie Xie,Xin Lin,Taifu Lang,Xiaowei Huang,Xuehuang Tang,Shuaishuai Wang,Chang Lin,Kaixin Zhang,Jie Sun,Qun Yan

DOI: https://doi.org/10.1063/5.0232745

IF: 6.6351

2024-10-01

APL Materials

Abstract:Micro light-emitting diode (Micro-LED) is a highly promising technology in the field of new displays, with the mass transfer process involved in its manufacturing process widely regarded as a major barrier to their further development. This study adopts laser transfer technology as the primary solution, using ablation-type transfer release materials that improve chip utilization rates over blister-type release materials. In addition, measurement of the laser transfer parameters, inspection, and laser repair technology are combined to achieve a transfer yield of about 100% to the carrier substrate and a cumulative transfer displacement of less than 1 μm in the Micro-LED inverted chip array. Furthermore, cleaning agents were used to remove adhesive residue from the receiving substrate after transfer, improving the bonding yield between the chip and the thin film transistor driver circuit board. This study provides a feasible solution for Micro-LED mass transfer, which could boost its further development toward commercial application.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology

92‐2: What Type of MicroLED: Flip Chip, Vertical, or Lateral?

37‐1: Invited Paper: Manufacturing Readiness of High‐Efficiency and Low‐Cost MicroLED Displays

84‐4: Transfer of Flip‐Chip Structure micro‐LED from Sapphire to Thin Film

21‐1: Invited Paper: Technology Trend and Challenges for MicroLED Large Display Applications

The micro-LED roadmap: Status quo and prospects

Mass transfer for Micro-LED display: Transfer printing techniques

Vertical full-colour micro-LEDs via 2D materials-based layer transfer

Super retina TFT based full color microLED display via laser mass transfer

The scaling of the microLED and the advantage of 2D materials

High-Density Integration of Ultrabright OLEDs on a Miniaturized Needle-Shaped CMOS Backplane

Wafer-Level Monolithic Integration of Vertical Micro-LEDs on Glass

Monolithically Integrated μ LEDs/HEMTs Microdisplay on a Single Chip by a Direct Epitaxial Approach

Challenges of high-yield manufacture in micro-light-emitting diodes displays: chip fabrication, mass transfer, and detection

91‐1: Invited Paper: Micro‐LED Stamp Transfer & Repair Technology for Tiling Display

A review of key technologies for epitaxy and chip process of micro light-emitting diodes in display application

24.1: Invited Paper: Micro‐LED 4.78 inch Tiled Display Modules with 100% Yield Achieved by Stamp Transfer Technology

Research Progress of Micro-LED Display Technology

Advanced Manufacturing of Microscale Light-Emitting Diodes and Their Use in Displays and Biomedicine

Towards Micro-Peled Displays

Transfer of Micro‐LEDs with Roll‐Based Direct Overlay Alignment for Manufacturing Transparent Displays

High-yield Micro-LED laser transfer accomplished using an ablation-type release material