Electrocaloric Properties of Lead‐Free Multilayer Ceramic Films Composed of 0.2Ba(Ti0.9Sn0.1)O3–0.8Ba(Zr0.18Ti0.82)O3

Liya Li,Xiuli Zhang,Haisheng Xu,Xingjia Li,Huiping Wang,Ying Hou
DOI: https://doi.org/10.1002/pssb.202400145
2024-05-30
physica status solidi (b) - basic solid state physics
Abstract:The electrocaloric performance of 0.2Ba(Ti0.9Sn0.1)O3–0.8Ba(Zr0.18Ti0.82)O3 ceramic is substantially improved by the addition of a sintering aid BaO–CaO–SiO2 glass. By comparing the samples with different monolayer film thicknesses, the maximum change in adiabatic temperature is obtained to be 1.5 °C for a monolayer film thickness of 21 μm. Lead‐free electrocaloric (EC) materials have attracted considerable attention due to their potential applications in environmentally friendly solid‐state cooling devices. Achieving a large adiabatic temperature change (ΔTEC ) at low applied voltage and good temperature stability is crucial and closely related to the phase structure and ferroelectric properties. In this study, 0.2Ba(Ti0.9Sn0.1)O3–0.8Ba(Zr0.18Ti0.82)O3 (BZSnT20) multilayer electrocaloric ceramics (MLEC) are synthesized and characterized for their phase structure and dielectric properties using X‐ray diffraction and dielectric testing. The ferroelectric performance of BZSnT20 is assessed by analyzing their polarization–electric field loops, and the ΔTEC is measured using a heat‐flow measurement system. By investigating the mechanisms, structure–activity relationship between the BaO–CaO–SiO2 (BCS) glass sintering aid and the ΔTEC , the optimal content of BCS glass sintering aid is obtained. In the case of BZSnT20 MLEC, a positive relationship between effective volume and ΔTEC is observed, consistent with theoretical calculations. Additionally, the ceramic layer is found to have no significant influence on the EC properties of the sample. In this study, valuable insights into modifying the dielectric and adiabatic temperature change performance in lead‐free MLEC are provided and a potential pathway for the development of low‐voltage EC cooling devices is suggested.
What problem does this paper attempt to address?