Abstract:Recently, various miniaturized electronic systems and the rapid increase in power density of microelectronic devices have created additional requirements for micro-scale heat dissipation technology. To dissipate heat in a micro-scale region efficiently, several creative cooling methods for high heat flux dissipation have been designed on the order of 1000 W/cm(2). Due to its high surface-to-volume ratio, the microchannel heat sink has become the most popular one among emerging technologies and an effective tool for high heat flux thermal management. Nevertheless, in common electronic microchannel cooling systems, the traditional parallel microchannel causes a dramatic pressure loss along channel length. In this regard, the manifold microchannel heat sink cooling technology becomes promising with its high heat dissipation potential and moderate pressure drop penalty. The shortened effective flow length compared with the traditional microchannel provides a smaller pressure drop and delays the onset of the critical-heat-flux point. However, while a number of numerical and experimental studies have been conducted for the single-phase flow in the manifold microchannel, two-phase flow boiling in this kind of channel is not widely employed because of its issues with flow pattern prediction. This work develops a new solver based on open source software OpenFOAM to perform the transient process of subcooled flow boiling in the manifold microchannel heat sink. Additionally, heat transfer in the silicon substrate is considered to improve the accuracy of simulation. Similar to single-phase flow simulation for the manifold microchannel, a unit cell model extracted from the whole cooling plate is employed for the two-phase boiling flow to avoid huge computational costs. Through several reasonable assumptions, the symmetry boundary condition is applied on four lateral surfaces in the unit cell, while uniform heat flux is adopted on the bottom wall. A uniform inlet velocity boundary estimated from the total volume flow rate condition is coupled with a fixed temperature value of 7 degrees C lower than saturation temperature. After the mesh independence test, the self-programming solver and numerical methods are validated by comparing numerical results with experimental data. It is determined that the boiling curve obtained by the empirical rate phase-change model with parameters r(1)=r(v)=100 agrees well with experimental results. Furthermore, heat transfer and pressure drop performance differences are caused by microchannel width w(c) and fin width w(f). In comparison to sample A (w(c)=w(f)=15 mu m), decreasing wc and wf simultaneously leads to lower average wall temperature of the heated surface; the channel pressure drop between inlet and outlet surfaces rises dramatically when the widths decrease. When the total number of microchannels in the manifold microchannel cooling plate remains unchanged, increasing wc results in a decreased wf. Based on experimental results, heat sink sample C shows that the pressure loss can be considerably reduced under the premise of sacrificing a small degree of heat transfer performance, which can be attributed to the increased microchannel hydraulic diameter. The manifold microchannel heat sink with w(c)>w(f) is recommended for practical application due to lower pressure loss and average temperature variation.

One-dimensional model of manifold microchannels for embedded cooling: Prediction of thermal performance and flow non-uniformity

Numerical Study on Performances of Mini-Channel Heat Sinks with Non-Uniform Inlets

A Numerical Study of Subcooled Flow Boiling in a Manifold Microchannel Heat Sink with Varying Inlet-to-outlet Width Ratio

Simulation of Subcooled Flow Boiling in Manifold Microchannel Heat Sink

Numerical investigation of heat transfer and pressure drop characteristics of flow boiling in manifold microchannels with a simple multiphase model

Numerical Study on the Heat Transfer Performance of Non-Newtonian Fluid Flow in A Manifold Microchannel Heat Sink

Numerical Investigation Of Flow Boiling In A Manifold Microchannel Heat Sink With Conjugate Heat Transfer

Analysis of Thermal Performance and Pressure Loss of Subcooled Flow Boiling in Manifold Microchannel Heat Sink

Single-phase and Two-phase Flow and Heat Transfer in Microchannel Heat Sink with Various Manifold Arrangements

Flow thermohydraulic characterization of hierarchical-manifold microchannel heat sink with uniform flow distribution

A Comparative Numerical Study on Two-Phase Boiling Fluid Flow and Heat Transfer in the Microchannel Heat Sink with Different Manifold Arrangements

Thermal and hydrodynamic characteristics of single-phase flow in manifold microchannels with countercurrent regions

A numerical investigation of the thermal–hydraulic performance during subcooled flow boiling in MMCs with different manifolds

Investigation of flow and heat transfer performance of the manifold microchannel with different manifold arrangements

Numerical investigation of novel manifold microchannel heat sinks with countercurrent regions

Numerical Study on Flow and Heat Transfer of a Hybrid Microchannel Cooling Scheme Using Manifold Arrangement and Secondary Channels

Numerical investigation and data-driven prediction of flow boiling heat transfer in manifold microchannels with slopes

Numerical Simulation of Subcooled Flow Boiling in a Manifold Microchannel Heat Sink

A Bi-Layer Compact Thermal Model for Uniform Chip Temperature Control with Non-Uniform Heat Sources by Genetic-Algorithm Optimized Microchannel Cooling

Numerical Investigation of the Effect of Microchannel Configurations on Subcooled Flow Boiling Heat Transfer Performance of Manifold Heat Sinks

Study on the uneven flow distribution and non-uniform heat transfer in microchannels