Multiple interaction electron beam powder bed fusion for controlling melt pool dynamics and improving surface quality

Nick Semjatov,Benjamin Wahlmann,Carolin Körner
DOI: https://doi.org/10.1016/j.addma.2024.104316
IF: 11
2024-07-26
Additive Manufacturing
Abstract:Low surface quality of fabricated parts and long processing times are two commonly stated reasons against a more wide-spread adoption of electron beam powder bed fusion (PBF-EB) as a commercially viable manufacturing technique. Aside from the large particle size distribution (45-150 μm) of processed powders, the surface roughness, limited structural resolution and process instabilities are attributed to unwanted dynamics of the melt pool, like spattering, balling, evaporation and melt pool displacement. As a result, a contouring step using slow but stable melting parameters is usually added to the process to improve surface quality, leading to increased processing times. In this study, we demonstrate how the surface quality can be improved by supplying the energy for melt pool formation over multiple, timely separated interactions. To investigate the effect of this multiple interaction processing (MIP), series of single line melt structures with increasing number of interactions were fabricated, characterized and corresponding thermal diffusion simulations performed. The experimental results show how MIP allows to lower surface roughness of melted structures through a reduction of spattering, balling and melt pool displacement during processing, while our simulation model identifies these benefits to be caused by a significant reduction in surface temperature and thus evaporation, with increasing number of interactions for melt pool formation. Our model further demonstrates, how a relatively simple, computationally inexpensive and thus scalable thermal diffusion model is capable of providing valuable information about thermal conditions during melt pool formation. Lastly, we introduce a few simple equations to calculate appropriate MIP parameters for any kind of scan strategy.
materials science, multidisciplinary,engineering, manufacturing
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