Origin of high thermal stability of amorphous Ge1Cu2Te3 alloy: A significant Cu-bonding reconfiguration modulated by Te lone-pair electrons for crystallization

Nian-Ke Chen,Xian-Bin Li,Xue-Peng Wang,Meng-Jiao Xia,Sheng-Yi Xie,Hai-Yu Wang,Zhitang Song,Shengbai Zhang,Hong-Bo Sun
DOI: https://doi.org/10.1016/j.actamat.2015.02.015
IF: 9.4
2015-05-01
Acta Materialia
Abstract:Ge1Cu2Te3 is an important candidate for high-temperature phase change memory due to the fine amorphous stability. Yet, the basic bonding chemistry for its high-temperature application is still not completely clear. In this work, a new bonding mechanism for its amorphous and crystalline phases is proposed and demonstrated by first-principles calculations. Compared to the tetrahedral environment distributed evenly in crystalline form, Cu atoms in the amorphous state tend to be accumulated as trigonal clusters. For the crystalline phase, a bonding configuration of nonequivalent sp 3 hybridization with Te lone-pair electrons is proposed without Cu d electron participation. In the amorphous phase, however, a significant bonding reconfiguration of Cu d electrons occurs due to the isolation of the Te lone-pair electrons. Therefore, the notable contrast in the Cu atomic and electronic structures between the crystalline and amorphous phases results in an obvious phase transition barrier for high-temperature storage. The mechanism presented in this study serves as a reference for other transition-metal alloyed phase-change materials.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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