Abstract:The heat flux density of modern micro devices is far greater than the heat dissipation capacity of traditional cooling methods. In order to further improve the comprehensive thermal performance of impingement-jet nested microchannel heat sink (IDN-MHS) and uniform the substrate temperature, a turbulence structure was introduced in this study. Using three-dimensional printing techniques, IDN-MHS is manufactured using two layers of impingement-jet printed microchannels. A different type of heat transfer can be achieved with IDN-MHS with Truncated Bifurcation (TBs) compared to traditional internal-external nested circuitry. In order to verify the results achieved by simulations, three-dimensional printers were subjected to experimental tests, and the results were in line with those predicted by the simulations. The range of Reynolds number tested in the experiments is from 138.20 to580.44. Impingement-Jet Double-Layer Nested Microchannel Heat Sinks with Vertical Truncated Bifurcation (IDN-MHS-TB) has significantly reduced the peak temperatures on the substrate according to these findings. It is found that the performance is best when the vertical truncated bifurcation is separated from the center plane by 0.75 mm in order to achieve the best overall performance. Using numerical simulations and experimental results, results from Impingement-Jet Double-Layer Nested Microchannel Heat Sinks with Vertical Truncated Bifurcation-0.75 (IDN-MHS-TB0.75) indicate a significant advantage over Impingement-Jet Double-Layer Nested Microchannel Heat Sinks (IDN-MHS-TB). In addition, Nusselt numbers for IDN-MHS-TB0.75 are significantly higher than those for IDN-MHS. IDN-MHS-TB0.75 does perform significantly better than standard impingement-jet nested microchannel heat sink (IDN-MHS) structure without bifurcations considering the comprehensive heat transfer characteristics factor, such as Nusselt number, pressure drop and thermal uniform on substrate. The practical implications of the work are strongly support the thermal management of electronic chips with high heat flux.

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