Tuning thermal conductivity of bismuth selenide nanoribbons by reversible copper intercalation

Yucheng Xiong,Nien-Chu Lai,Yi-Chun Lu,Dongyan Xu

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2020.120077

IF: 5.2

2020-10-01

International Journal of Heat and Mass Transfer

Abstract:<p>Actively tuning thermal transport properties of materials at nanoscale is of great interest in many applications. In this work, we demonstrated reversible copper (Cu) intercalation on individual bismuth selenide (Bi₂Se₃) nanoribbons and investigated the effects of intercalation/de-intercalation of Cu atoms on their thermal transport properties. Distinct from prior studies that have shown reduced thermal conductivity (<em>κ</em>_tot) after intercalation, a crossover in <em>κ</em>_tot was observed over the measured temperature range in this work, i.e., <em>κ</em>_tot is significantly suppressed at low temperatures but enhanced above 250 K by Cu intercalation. This intriguing crossover phenomenon is attributed to the interplay between the enhanced electronic thermal conductivity (<em>κ</em>_e) and the reduced lattice thermal conductivity (<em>κ</em>_p_h), both of which result from the intercalated Cu atoms. Moreover, we showed that thermal conductivity could be further tuned by the de-intercalation of Cu atoms. Compared to the pristine nanoribbon, a dramatically lower in-plane <em>κ</em>_p_h was observed for intercalated and de-intercalated nanoribbons due to the formation of the Cu/Bi₂Se₃ superlattice structure. Theoretical modeling revealed that the reduced <em>κ</em>_p_h was primarily owing to the enhancement of phonon boundary scattering and point defect scattering. This work provides a facile approach to tune thermal transport properties at nanoscale, which can be potentially used in thermal switch and thermoelectric applications.</p>

engineering, mechanical,thermodynamics,mechanics