Direct ink writing of copper-based highly conductive tracks on flexible substrate for electronic applications

Vivek Kumar Gupta,Narendra Kumar
DOI: https://doi.org/10.1016/j.matlet.2024.137008
IF: 3
2024-07-18
Materials Letters
Abstract:This work reports the fabrication and electrical characterization of conductive copper ink (CCI) deposited on flexible substrates using an in-house developed direct ink writing (DIW) technique. CCI tracks deposited on two flexible substrates were evaluated for uniformity, continuity, and electrical performance under various temperature and mechanical loads. The results indicated that with optimized printing parameters, uniform, and continuous tracks were successfully deposited, achieving a track width of 355 μm and an electrical conductivity of 1.21 × 10 6 S/m. Notably, bending caused little change in the electrical conductivity, whereas temperature had a greater effect. To demonstrate the practical applicability in electronics, a single conductive layer was printed by replicating the actual geometries of the printed circuit board.
materials science, multidisciplinary,physics, applied
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