Thermal Analysis of a Satellite Borne Instrument

Bo Chen,Ning Li
DOI: https://doi.org/10.4028/www.scientific.net/AMM.536-537.1397
2014-04-01
Abstract:Thermal design and analysis of a satellite instrument is introduced in this paper. Some methods were adopted to help heat conduct and a finite element model was built. The analysis results showed that the temperature scopes of the main structures are from 45°C to 65.8°C and all of junction temperatures of the components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.
Engineering
What problem does this paper attempt to address?