Ultra‐Stretchable Spiral Hybrid Conductive Fiber with 500%‐Strain Electric Stability and Deformation‐Independent Linear Temperature Response

Jianpeng Wu,Min Sang,Jingyi Zhang,Yuxi Sun,Xinyi Wang,Junshuo Zhang,Haoming Pang,Tianzhi Luo,Shaoshan Pan,Shouhu Xuan,Xinglong Gong
DOI: https://doi.org/10.1002/smll.202207454
IF: 13.3
2023-02-18
Small
Abstract:A unique conductive fiber with deformation‐invariant electrical properties is synthesized by mimicking cucumber tendrils. With the homochiral coiled configuration, this fiber not only enables robust electrical stability at extreme tensile state, but maintains highly identical temperature sensitivity from 0% to 500% strain, which shows great superiority in lossless power transferring and expeditious thermal analyzing over commercial electronics. Stretchable configuration occupies priority in devising flexible conductors used in intelligent electronics and implantable sensors. While most conductive configurations cannot suppress electrical variations against extreme deformation and ignore inherent material characteristics. Herein, a spiral hybrid conductive fiber (SHCF) composed of aramid polymeric matrix and silver nanowires (AgNWs) coating is fabricated through shaping and dipping processes. The homochiral coiled configuration mimicked by plant tendrils not only enables its high elongation (958%), but also generates a superior deformation‐insensitive effect to existing stretchable conductors. The resistance of SHCF maintains remarkable stability against extreme strain (500%), impact damage, air exposure (90 days), and cyclic bending (150 000 times). Moreover, the thermal‐induced densification of AgNWs on SHCF achieves precise and linear temperature response toward a broad range (−20 to 100 °C). Its sensitivity further manifests high independence to tensile strain (0%–500%), allowing for flexible temperature monitoring of curved objects. Such unique strain‐tolerant electrical stability and thermosensation hold broad prospects for SHCF in lossless power transferring and expeditious thermal analysis.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
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