Abstract:The upcoming High-Luminosity running phase of the LHC will require a complete replacement of the current tracking system in the CMS experiment. With the planned integrated luminosity of up to 4000Â fb âˆ’1 to be delivered to the experiments, the innermost layers of the CMS Inner Tracker (IT) will face particle fluences of up to a non-ionizing energy loss (NIEL) of Î¦eq Â =Â 3.5Â Ã— Â 10 16 Â cm âˆ’2 . Through an extensive R&D program involving multiple vendors, several pixel sensor options have been thoroughly evaluated, considering different pixel pitches and sensor cell designs. Recently, the final choices have been made. All layers, except the innermost layer of the barrel section of the IT, will be equipped with planar n-in-p sensors featuring an active thickness of 150Î1⁄4m and pixel pitches of 25Â Ã— Â 100Î1⁄4m 2 . During the initial phase of the sensor qualification campaign, the sensors were coupled with demonstrator chips (RD53A), and the modules were exposed to fluences of up to Î¦eq Â =Â 2.0Â Ã— Â 10 16 Â cm âˆ’2 , undergoing comprehensive testing at both CERN and DESY test beam facilities. In 2023, single chip assemblies, along with the first full modules incorporating the final, full-size prototype readout chip (RD53B-CMS) irradiated up to Î¦eq Â =Â 1.0Â Ã— Â 10 16 Â cm âˆ’2 , have become available and were tested at DESY. In this article, an overview of the preliminary test beam results will be provided. The studies will cover hit efficiency, spatial resolution, and noise hit occupancy for both non-irradiated samples and irradiated assemblies. The preliminary findings are in line with previous results obtained with RD53A assemblies. The measurements described in this contribution paved the way for the submission of the final readout chip and kickoff batches for planar production sensors for the Inner Tracker that have been launched recently.

First results on the final readout chip for the High-Luminosity LHC upgrade of the CMS Inner Tracker

Serial powering characterisation for the CMS Inner Tracker at the High Luminosity LHC

Test beam results of irradiated modules for the CMS Phase-2 upgrade equipped with HPK planar pixel sensors and RD53B-CMS readout chips

Evaluation of Planar Silicon Pixel Sensors with the RD53A Readout Chip for the Phase-2 Upgrade of the CMS Inner Tracker

R&D for the CLIC Vertex and Tracking detectors

Operation and performance of the CMS tracker

Radiation-Hard Active Pixel Sensors for Hl-Lhc Detector Upgrades Based on Hv-Cmos Technology

Beam Test Performance Studies of CMS Phase-2 Outer Tracker Module Prototypes

Mighty Tracker -- Performance Studies of the MightyPix for LHCb

Design and Performance of HV CMOS Sensors for Future Colliders by the RD50 Collaboration

Characterization of a high bandwidth readout chain for the CMS Phase-2 pixel upgrade

Radiation Hardness of Two CMOS Prototypes for the ATLAS HL-LHC Upgrade Project.

Pixel detector R&D for the Compact Linear Collider

Performance verification of the CMS Phase-1 Upgrade Pixel detector

Status of the CMS Phase I Pixel Detector Upgrade

MightyPix at the LHCb Mighty Tracker — verification of an HV-CMOS pixel chip's digital readout

First measurements with monolithic active pixel test structures produced in a 65 nm CMOS process

Active Pixel Sensors in ams H18/H35 HV-CMOS Technology for the ATLAS HL-LHC Upgrade

CLICTD: A monolithic HR-CMOS sensor chip for the CLIC silicon tracker

The CMS Phase-1 Pixel Detector Upgrade

Pixel front-end development in 65 nm CMOS technology