Abstract:Package lid and heat sink incorporated in PCB or chip package are often used for solving the heat dissipation problem, which is easy to form a resonant cavity with the metal ground plane of the package substrate, and consequently result in the noise current coupling to the package cover and heat sink through the capacitive effect, causing serious EMI problems, therefore, we propose a new resistive film-based super material absorber structure. In this paper, a unit of the proposed structure has resistive film patterns on the FR-4 substrate in front of the conductive plate, and the top layer uses Jerusalem cross, square and L-shaped resistive film to achieve bandwidth expansion. The unit size of the entire absorber is 0.15$\lambda_{L}\times 0.15\lambda_{L}(\lambda_{L}$ is the wavelength corresponding to the lowest cut-off frequency), while the thickness is only $0.07\lambda_{L}$. The simulation results show that the absorption rates are more than 90% in the frequency range from 22-40GHz. When the electromagnetic waves are perpendicular to the proposed resistive film absorber, it is insensitive to the polarization of TE and TM modes, and the absorption rates remain stable when the incident wave is wide-angle. Based on the equivalent medium theory, it is demonstrated that the structure achieves good impedance matching with free space in a wide frequency band. Meanwhile, the absorption mechanism of this structure is analyzed by the distribution of electric field and surface current, and the equivalent circuit model of resistive film absorber is established. The proposed resistive film absorber is characterized by miniaturization, ultra-wideband, high absorption rates, and insensitivity to polarization, providing a new idea for radiation suppression of highly integrated electronic devices.

On the Design of Ultralow-Profile Broadband Absorber Based on Non-Foster Circuit

Ultrabroadband and Omnidirectional Absorbers Based on a Tandem Multilayer Structure

Flexible Design and Realization of Wideband Microwave Absorber with Double-Layered Resistor Loaded FSS

Ultrabroadband Double-Sided and Dual-Tuned Active Absorber for UHF Band

On the Design of Wideband Absorber Based on Multilayer and Multiresonant FSS Array

On the design of ultra-wideband circuit analog absorber based on quasi-single-layer FSS

Ultra-thin broadband absorber using active non-Foster devices and FSS-magnetic material

Analysis FSS Absorber with Diversified Impedance for Broadband Applications

Ultra-wideband Passive Double-Layer Absorber Design from the Reflective Point

An Ultra-Thin Broadband Active Frequency Selective Surface Absorber For Ultrahigh-Frequency Applications

Thin and Broadband Electromagnetic Absorber Design Using Resistors and Capacitors Loaded Frequency Selective Surface

Novel Frequency-Selective Rasorber with Ultrawide Absorption Bandwidth Covering Both the X- and Ku-Bands

Design and Analysis of a Dynamically Tunable Ultra-Broadband Flexible Microwave Absorber

Design of a Dual-Band Electromagnetic Absorber with Frequency Selective Surfaces

Design of a Tunable Low-Frequency and Broadband Radar Absorber Based on Active Frequency Selective Surface

A Composite Absorber of FSS and Area-coated Honeycomb Using High-loss Materials for Broadband Applications

An Ultra-Wideband Metamaterial Absorber With Active Frequency Selective Surface

Broadband and Omnidirectionally Matched Absorber for a Discrete Source

Backend-Balanced-Impedance Concept for Reverse Design of Ultra-Wideband Absorber

Analysis and Enhancement of the Bandwidth of Ultrathin Absorbers Based on High-Impedance Surfaces

A Miniaturized Ultra-wideband Resistive Film Absorber for Radiation Suppression