Abstract:To address the interfacial heat/force transfer problem, realizing the joint improvement of adhesion energy and thermal conductivity, a method for hierarchical energy dissipation is proposed in this paper. A thermal interface material, a borate ester bond‐reinforced and epoxy‐functionalized polydimethylsiloxane filled aluminum filler composite elastomer, is used as a research model to achieve high adhesion energy (1.17 kJ m−2) and thermal conductivity (3.46 W m−1 K−1). Interfaces play an important role in the heat and stress transfer within applications such as electronic cooling. The coexistence of apparently contradictory properties between heat dissipation and adhesion at interfaces poses a constant challenge for existing interface materials. Herein, a thermal interface material is reported, consisting of epoxy‐functionalized polydimethylsiloxane and aluminum fillers with excellent interfacial heat/force transfer ability. This material optimizes the combination of thermal conductivity of 3.46 W m−1 K−1 and adhesion energy of 1.17 kJ m−2. Using two viscoelastic models, the excellent interfacial force transfer ability is attributed to a hierarchical energy dissipation via the introduction of borate ester bonds and the aluminum filler networks. A simple kinetic bond model demonstrates that the borate ester bonds increase molecular chain segment mobility, allowing full extension at debonding interface for stress dispersion and efficient energy dissipation. The aluminum filler networks not only facilitate thermal transfer, but also dissipate the mechanical energy during filler network destruction due to the bond breakage between fillers. The excellent heat dispassion and mechanical stability are further demonstrated when this thermal interface material is used in flexible light emitting diodes and high‐power chips. This work provides a new strategy for balancing interfacial heat and force transfer.

Heat transfer origin of adhesion behaviors between liquid-aluminum and solid aluminum/silicon interfaces

Effect of substrate temperature on adhesion at liquid-aluminum/silica interface by phantom wall method

Disclosing the contribution of vacancy defects to thermal transport at a liquid-Al/graphene adhesion interface

Thermal Interface Conductance between Aluminum and Silicon by Molecular Dynamics Simulations

The diffusion behaviors at the Cu-Al solid-liquid interface: A molecular dynamics study

The effect of crystallographic orientation of α-Al2O3on the wetting behavior and adhesion characteristics of aluminum droplets

Investigation on the Diffusion Behaviors and Mechanical Properties of the Ti/Al Interface Using Molecular Dynamics Simulation

The effect of crystallographic orientation of α-Al2O3 on the wetting behavior and adhesion characteristics of aluminum droplets

Effect of atomic diffusion on interfacial heat transfer and tensile property of copper/aluminum composites

A study of how solid–liquid interactions affect flow resistance and heat transfer at different temperatures based on molecular dynamics simulations

Wetting and Spreading Characteristics of the Impact of Molten Aluminum Droplets on Surfaces

Contribution of Capillary Adhesion to Friction at Macroscopic Solid–Solid Interfaces

Molecular Dynamics Investigation Of The Slip Flow Liquid-Solid Interfacial Thermal Conductance

Ab initio molecular dynamics study on the local structures and solid/liquid interface in liquid Al-Ti and Al-B-Ti alloys

Heat Transfer Characteristics in an Asymmetrical Solid–Liquid System by Molecular Dynamics Simulations

Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation

Thermal interface conductance between aluminum and aluminum oxide: A rigorous test of atomistic level theories

Mechanism Research of Coupling Drag Reduction and Heat Transfer on Surface With Different Liquid-Solid Interaction

Atomic-scale investigation of Si/Al interface in multilayer aluminum sheets using HRTEM and first-principle calculation

Chemical heterogeneity size effects at nanoscale on interface thermal resistance of solid–liquid polymer interface via molecular dynamics simulations

Interdiffusion cross-high-entropy alloys, nano-multilayer foils, and Al interface: An atomistic simulation