Epoxy composite with metal-level thermal conductivity achieved by synergistic effect inspired by lamian noodles
Maohua Li,Linhong Li,Yapeng Chen,Yue Qin,Xianzhe Wei,Xiangdong Kong,Zhenbang Zhang,Shaoyang Xiong,Hainam Do,James C. Greer,Zhongbin Pan,Xiaoxue Shui,Tao Cai,Wen Dai,Kazuhito Nishimura,Cheng-Te Lin,Nan Jiang,Jinhong Yu
DOI: https://doi.org/10.1016/j.compscitech.2022.109677
IF: 9.1
2022-09-29
Composites Science and Technology
Abstract:To enhance thermal dissipation from packaged electronic components, a material with high thermal conductivity and low coefficient thermal expansion is required. In this work, a strategy inspired by the processing of lamian, a type of traditional Chinese noodle, is proposed. By combining two important methods, aligning filler and bridging effect, the method can construct composites with both high thermal conductivity and coefficient thermal expansion. The epoxy composite exhibits a high thermal conductivity of 110 W m−1 K−1 and a low coefficient of thermal expansion of 7.4 ppm K−1, which can be compared to the value for metals. On the other hand, the material's density is comparable to that of polymers and is consequently much lower than that of typical metals. Considering these advantageous properties, it is anticipated that these composites can play a leading role in the development of new, low cost packaging materials.
materials science, composites