Shaping hollow spherical assemblies for enhanced Cu0/Cu+ interface to boost C2+ selectivity in CO2 electroreduction

Yu Li,Haojun Shi,Congcong Li,Zhongliang Liu,Weizheng Tang,Tingting Zhang,Shixin Yin,Huihui Li,Chunzhong Li
DOI: https://doi.org/10.1007/s40843-024-3057-1
2024-09-22
Science China Materials
Abstract:The creation of Cu 0 /Cu + interface over Cu-based catalysts is known to facilitate the production of multi-carbon (C 2+ ) products during CO 2 reduction reaction (CO 2 RR). However, the Cu + moieties exhibit high susceptibility towards reduction into Cu 0 at a high current density. Thus, a comprehensive understanding and rational shaping strategy for the construction and stabilization of Cu 0 /Cu + interface in Cu-based catalysts is imperative. Herein, we proposed a controllable "nanoparticle assembly" strategy to obtain hollow spherical assemblies (HSA) composed of numerous Cu 2 O nanoparticles (HSA-Cu 2 O). The HSA-Cu 2 O catalysts significantly enhance the selectivity of C 2+ products, resulting in an impressive overall Faraday efficiency (FE) of 79.2% ± 0.7% at a partial current density of 317.1 mA cm −2 . The HSA-Cu 2 O catalysts undergo in-situ electrochemically reconstruction during CO 2 RR, achieving Cu 0 /Cu + interfacial sites with a high density. The Auger electron spectra, in-situ Raman, and morphological evolution studies have confirmed that the combination of the Cu 0 /Cu + interface and hollow sphere architecture facilitated the concentration of *CO intermediates, thereby promoting C–C dimerization to boost C 2+ selectivity in CO 2 RR.
materials science, multidisciplinary
What problem does this paper attempt to address?