Assembled one-dimensional nanowires for flexible electronic devices via printing and coating: Techniques, applications, and perspectives

Xin Xu,Pan Xue,Meng Gao,Yibin Li,Zijun Xu,Yu Wei,Zhengjian Zhang,Yang Liu,Lei Wang,Hongbin Liu,Bowen Cheng
DOI: https://doi.org/10.1016/j.cis.2023.102987
IF: 15.19
2023-08-31
Advances in Colloid and Interface Science
Abstract:The rapid progress in flexible electronic devices has necessitated continual research into nanomaterials, structural design, and fabrication processes. One-dimensional nanowires, characterized by their distinct structures and exceptional properties, are considered essential components for various flexible electronic devices. Considerable attention has been directed toward the assembly of nanowires, which presents significant advantages over randomly distributed ones. Printing and coating techniques can be used to assemble nanowires in a relatively simple, efficient, and cost-competitive manner and exhibit potential for scale-up production in the foreseeable future. This review aims to provide an overview of nanowire assembly using printing and coating techniques, such as bar coating, spray coating, dip coating, blade coating, and 3D printing. The application of assembled nanowires in flexible electronic devices is subsequently discussed. Finally, further discussion is presented on the potential and challenges of flexible electronic devices based on assembled nanowires via printing and coating.
chemistry, physical
What problem does this paper attempt to address?