Abstract:Strain engineering is a powerful tool, that can strongly modulate the physical and physicochemical properties of 2D materials. Particularly, the lattice distortion‐induced modification in the electronic band structure enables the emergence of many excellent properties that greatly expand the applicability of 2D materials in the fields of flexible electronics, flexible photo‐/image‐sensors, flexible strain sensors, and wearable bioelectronics devices. Strain engineering is a powerful strategy that can strongly influence and tune the intrinsic characteristics of materials by incorporating lattice deformations. Due to atomically thin thickness, 2D materials are excellent candidates for strain engineering as they possess inherent mechanical flexibility and stretchability, which allow them to withstand large strains. The application of strain affects the atomic arrangement in the lattice of 2D material, which modify the electronic band structure. It subsequently tunes the electrical and optical characteristics, thereby enhances the performance and functionalities of the fabricated devices. Recent advances in strain engineering strategies for large‐area flexible devices fabricated with 2D materials enable dynamic modulation of device performance. This perspective provides an overview of the strain engineering approaches employed so far for straining 2D materials, reviewing their advantages and disadvantages. The effect of various strains (uniaxial, biaxial, hydrostatic) on the characteristics of 2D material is also discussed, with a particular emphasis on electronic and optical properties. The strain‐inducing methods employed for large‐area device applications based on 2D materials are summarized. In addition, the future perspectives of strain engineering in functional devices, along with the associated challenges and potential solutions, are also outlined.

Strain‐Engineered 2D Materials: Challenges, Opportunities, and Future Perspectives