Graphene-All-Around Cobalt Interconnect with a Back-End-of-Line Compatible Process

Chi-Yuan Kuo,Jia-Heng Zhu,Yun-Ping Chiu,I-Chih Ni,Mei-Hsin Chen,Yuh-Renn Wu,Chih-I Wu
DOI: https://doi.org/10.1021/acs.nanolett.3c04833
IF: 10.8
2024-02-01
Nano Letters
Abstract:The graphene-all-around (GAA) structure has been verified to grow directly at 380 °C using hot-wire chemical vapor deposition, within the thermal budget of the back end of the line (BEOL). The cobalt (Co) interconnects with the GAA structure have demonstrated a 10.8% increase in current density, a 27% reduction in resistance, and a 36 times longer electromigration lifetime. X-ray photoelectron spectroscopy and density functional theory calculations have revealed the presence of bonding between...
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
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