Abstract:The virtual metrology model using tree-based ensemble models in semiconductor wafer physical vapor deposition (PVD) is verified with high predict accuracy and good performance.The virtual metrology model using tree-based ensemble model in semiconductor PVD process is significantly better than LASSO regression, partial least squares regression, support vector machine, Gaussian process regression and artificial neural network regression.The performance of virtual metrology model based on SMBO with surrogate model can find better hyperparameters faster and obtain higher virtual metrology accuracy comparing to the commonly used random search hyperparameter optimization method.In order to improve the accuracy of semiconductor wafer virtual metrology, and overcome the physical metrology delay of wafer acceptance test, a virtual physical vapor deposition metrology method based on combination of tree-based ensemble models is proposed to conduct online virtual metrology on semiconductor wafer electrical parameters, and use hyperparameter optimization technique to perform model optimization and to achieve real-time alarm on process deviation. This combination of tree-based ensemble model combines Bagging, Boosting, and Stacking techniques. First, based on 4 types of base learner, Random Forest, Extra-Trees, XGBoost, and lightGBM, preliminary virtual metrology is performed on wafer PVD process, and then transforms the predict results of the 4 base learners into meta feature vector as the input of meta learner lightGBM to perform further virtual metrology. The Sequential model-based optimization algorithm is used to improve the accuracy of virtual metrology. First, the initial hyperparameter of the sequential model-based optimization is initialized by using random sampling, then the combination model is approximated by the surrogate model of tree-structured Parzen estimator, and the recommended hyperparameters is obtained by using EI (Expected Improvement), and then the optimized combination model is obtained. Finally, the superiority of the method proposed in this paper is verified by studying the results comparing to the common virtual metrology methods on the PVD process. The experiment shows the result of resistivity metrology using the combination of tree-based ensemble models in the PVD process is significantly better than LASSO regression, partial least squares regression(PLSR), support vector machine(SVR), Gaussian process regression(GPR) and artificial neural network regression(ANN).

Multi-source AdaBoost with cross-weight method for virtual metrology in semiconductor manufacturing

Multi-source adaptive thresholding adaboost with application to virtual metrology

Just-In-Time Modeling with Variable Shrinkage Based on Gaussian Processes for Semiconductor Manufacturing

Development of Convolutional Neural Network Based Gaussian Process Regression to Construct a Novel Probabilistic Virtual Metrology in Multi-Stage Semiconductor Processes

A Model Combining Seq2Seq Network and LightGBM Algorithm for Industrial Soft Sensor

Convolutional Neural Networks for Multi-Stage Semiconductor Processes

Machine Learning based CVD Virtual Metrology in Mass Produced Semiconductor Process

Virtual metrology of semiconductor PVD process based on combination of tree-based ensemble model

An Integrated Method for High-Dimensional Imbalanced Assembly Quality Prediction Supported by Edge Computing

Soft-Sensing Regression Model: From Sensor to Wafer Metrology Forecasting

Virtual metrology in semiconductor manufacturing: Current status and future prospects

Convolutional Neural Networks for Automatic Virtual Metrology

Multiscale Cost-Sensitive Learning-Based Assembly Quality Prediction Approach under Imbalanced Data

Local Parameter Optimization of LSSVM for Industrial Soft Sensing with Big Data and Cloud Implementation

A Concise Subspace Projection Based Meta-learning Method for Fast Modeling and Monitoring in Multi-grade Semiconductor Process

Semiconductor Price Index Predicting Based on a Novel Improved AdaBoost Feature-Weighted Combination Model

Soft Sensing Regression Model: from Sensor to Wafer Metrology Forecasting

ARIMA-AdaBoost hybrid approach for product quality prediction in advanced transformer manufacturing

Prediction of highly imbalanced semiconductor chip-level defects using uncertainty-based adaptive margin learning

Multi-Stage Process Diagnosis Networks in Semiconductor Manufacturing

Virtual Metrology Based on Graph Convolutional Neural Network for Semiconductor PVD Process