Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging (Adv. Mater. 38/2022)

Hongying He,Weixiang Peng,Junbo Liu,Xin Ying Chan,Shike Liu,Li Lu,Hortense Le Ferrand
DOI: https://doi.org/10.1002/adma.202270266
IF: 29.4
2022-09-25
Advanced Materials
Abstract:Heat Transfer In article number 2205120, Hortense Le Ferrand and co‐workers present a high‐thermal‐conductivity BN‐based composite with locally oriented microstructures that can conduct heat intentionally toward specific areas. The customizable heat‐transfer paths highlight a solution for thermal management of future 3D integrated electronics.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
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