Modeling the buckling and delamination of thin films

E. A. Jagla

DOI: https://doi.org/10.1103/physrevb.75.085405

IF: 3.7

2007-02-05

Physical Review B

Abstract:I study numerically the problem of delamination of a thin film elastically attached to a rigid substrate. A nominally flat elastic thin film is modeled using a two-dimensional triangular mesh. Both compression and bending rigidities are included to simulate compression and bending of the film. The film can buckle (i.e., abandon its flat configuration) when enough compressive strain is applied. The buckled configurations of a piece of film with stripe geometry are investigated as a function of the compressive strain. It is found that the stable configuration depends strongly on the applied strain and the Poisson ratio of the film. Next, the film is considered to be attached to a rigid substrate by springs that can break when the detaching force exceeds a threshold value, producing partial delamination of the film. Delamination is induced by a mismatch of the relaxed configurations of film and substrate. The morphology of the delaminated film can be followed and compared with available experimental results as a function of model parameters. “Telephone-cord,” polygonal, and “brainlike” patterns qualitatively similar to experimentally observed configurations are obtained in different parameter regions. The main control parameters that select the different patterns are the strain mismatch between film and substrate and the degree of in-plane relaxation within the unbuckled regions.

physics, condensed matter, applied,materials science, multidisciplinary