Abstract:It is extremely difficult to obtain high output power with silicon based processes, which presents one of the greatest challenges for realizing fully integrated transceivers, especially at millimeter-wave frequencies. For this reason, various power combining methods have been proposed to achieve higher power levels.In this paper, a novel power combining method suitable for millimeter-wave applications is presented. The power combining network is synthesized in package utilizing wafer level packaging technology, with an array of power sources of moderate output power capability assumed to be distributed on chip, which means applying further combining in addition to existing on-chip power combining scheme for potentially even higher output power is possible.The power combining network is composed of more basic power combining units, each consisting of one substrate integrated waveguide (SIW) resonator coupling four lambda/4 standing-wave resonators, which can be synthesized using two quarter-wavelength vertical vias with one end open and the other end shorted. For power combining purpose, the open end of each lambda/4 resonator is connected to the differential output of one on-chip power source, while the shorted end is realized using one of the two metal plates of the SIW resonator. The coupling between the SIW resonator and lambda/4 resonators is through slotting on the metal plate to allow magnetic leakage so that oscillation in lambda/4 resonators will excite the SIW resonator to oscillate. As the quality factor of the SIW resonator is much larger than those of lambda/4 resonators, energy is mainly confined in the cavity of the SIW resonator so that power combing is achieved.Example design for 60 GHz application is detailed in the paper with simulation results using commercial CST software showing the effectiveness of the power combining method.

High-Isolated Wireless Power and Information Co-Delivery by Exploiting Backscattered 2 nd Harmonics

Wireless Power Transfer with Additional Third Harmonic: Theoretical Analysis, Design, and Demonstration

Dual Resonant Frequency Inductive Power Transfer in an Underwater Tight Coupling System

A New Simultaneous Wireless Power and Information Transfer System with Integrated Signal Magnetic Coupler.

Novel Millimeter-Wave Power Combining Utilizing Wafer Level Packaging Technology

Collaborative Design of a New Dual-Bandpass 180 Hybrid Coupler

Input Signal Distribution Using Coupled Lambda/2 Standing-Wave Oscillators For Coherent Power Combining

A Novel Compact Dual-Band Antenna Array With High Isolations Realized Using the Neutralization Technique

A Dual Frequency Tuning Method for Improved Coupling Tolerance of Wireless Power Transfer System

Wireless Power and Information Dual Transfer System Via Magnetically Coupled Resonators

A Dual-Frequency-Detuning Method for Improving the Coupling Tolerance of Wireless Power Transfer

Highly-Isolated RF Power and Information Receiving System Based on Dual-Band Dual-Circular-Polarized Shared-Aperture Antenna

Design and Implementation of Broadband Hybrid 3-dB Couplers with Silicon-Based IPD Technology

Orthogonal-Frequency Simultaneous Wireless Power and Data Transfer for High-Power Wireless EV Charging

A Dual-Frequency Modular Wireless Power Transfer System for Auxiliary Power Supply of Power Electronics Converters

High Isolation Dual-Band Compact Duplex Array Based on Radiator-Shared System

Wireless Power and Data Transfer Via a Common Inductive Link Using Frequency Division Multiplexing

An Isolated Three-Way Power Combiner via Magnetically Coupled Microstrip Ring Probes

Enhancing Misalignment Tolerance in Hybrid Wireless Power Transfer System With Integrated Coupler via Frequency Tuning

Dual-Transmitter Inductive Power Transfer System with Improved Misalignment Tolerance and High Compatibility with Different-Sized Receivers

A Dual-Frequency Dual-Load Multirelay Magnetic Coupling Wireless Power Transfer System Using Shared Power Channel