Enhanced Dielectric, Thermal, Energy Storage, Quality Factor, Impedance, and Conductivity Properties of Novel PVDF/PAN/ZrO2 Polymer Nanocomposites for Flexible Electronics Applications

A. Vilvanatha Prabu,G. V. Vijayaraghavan,M. Basheer Ahamed,R. Suganya
DOI: https://doi.org/10.1002/pat.6599
IF: 3.348
2024-10-11
Polymers for Advanced Technologies
Abstract:In this study, novel polymer nanocomposite films based on polyvinylidene fluoride/polyacrylonitrile/zirconium dioxide (PVDF/PAN/ZrO2) were prepared using a solution casting technique. The structural modifications and morphological properties were analyzed by x‐ray diffraction (XRD) and high resolution scanning electron microscopy (HRSEM). The obtained results verified the filler‐polymer interactions and uniform dispersion of the ZrO2 filler in the host polymers (PVDF and PAN). Thermal stability of up to 46% leftover residue for 30% ZrO2 nano‐filler loading in the blend polymer nanocomposite was analyzed by thermogravimetric analysis (TGA). The dielectric properties such as dielectric constant and dielectric loss values and impedance, Q‐factor, and AC conductivity were analyzed using an impedance analyzer. The decrement in impedance with increasing nano‐filler content with improved dielectric, thermal, Q‐factor, energy density and conductivity properties signifies the prepared novel PVDF/PAN/ZrO2 polymer nanocomposite as an effective material for flexible electronics applications.
polymer science
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