Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti 3 C 2 T x MXene/Graphene Framework Connected by a Hydrogen-Bonded Interface

Xue Tan,Te-Huan Liu,Wenjiang Zhou,Qilong Yuan,Junfeng Ying,Qingwei Yan,Le Lv,Lu Chen,Xiangze Wang,Shiyu Du,Yan-Jun Wan,Rong Sun,Kazuhito Nishimura,Jinhong Yu,Nan Jiang,Wen Dai,Cheng-Te Lin
DOI: https://doi.org/10.1021/acsnano.2c01716
IF: 17.1
2022-06-10
ACS Nano
Abstract:The rapid increase of operation speed, transmission efficiency, and power density of miniaturized devices leads to a rising demand for electromagnetic interference (EMI) shielding and thermal management materials in the semiconductor industry. Therefore, it is essential to improve both the EMI shielding and thermal conductive properties of commonly used polyolefin components (such as polyethylene (PE)) in electronic systems. Currently, melt compounding is the most common method to fabricate...
materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology
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