Evaluation of dynamic fracture toughness of a bonded bi-material interface subject to high-strain-rate shearing using digital image correlation

Tomohisa Kojima,Yuta Kimura,Shuichi Arikawa,Mitsuo Notomi
DOI: https://doi.org/10.1016/j.engfracmech.2020.107391
IF: 5.4
2021-01-01
Engineering Fracture Mechanics
Abstract:<p>In this study, the fracture toughness at the bi-material interface of layered test pieces is determined using digital image correlation (DIC) measurements as part of dynamic shear tests. High-strain-rate shear tests are conducted on a three-layered bonded test piece comprising a central aluminum layer with PMMA resin layers. When the crack is sufficiently shorter than the bonding interface length, mode II fracture appears at the aluminum–PMMA interface; otherwise, mode I and mode II fractures appear. As the obtained stress intensity factor is consistent with the literature values, a reasonable interface fracture toughness can be evaluated using the DIC measurement.</p>
mechanics
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