Effect of substrate on the near-field radiative heat transfer between α-MoO3 films
Haotuo Liu,Kun Yu,Kaihua Zhang,Qing Ai,Ming Xie,Xiaohu Wu
DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2023.124206
IF: 5.2
2023-08-01
International Journal of Heat and Mass Transfer
Abstract:Near-field radiative heat transfer (NFRHT) has promising prospects in modern nanotechnology, such as near-field thermal microscopy, nanoscale non-contact thermal management, and information processing. Experimentally, supported substrates are crucial in ensuring structural stability, especially in ultrathin structures. However, the effect of the substrate on the NFRHT has seldom been explored. Here, the NFRHT between α-MoO3 films with different permittivities of substrate is studied. For lossless substrates, the NFRHT is suppressed as the permittivity of the substrate increases when the heat transfer is along the [010] and [100] crystal directions of α-MoO3. When the NFRHT is along the [001] crystal direction of α-MoO3, high-permittivity substrates suppress the NFRHT when the film is thin (< 10 nm), while enhancing the NFRHT in thicker films (> 10 nm). Moreover, we find that the effect of the substrate on the NFRHT highly relies on film thickness. The effect of lossy substrate on NFRHT is also discussed. We find that the loss of the substrate is more significant for the enhancement of heat flux at a small gap distance (20 nm). However, when the gap distance is large (100 nm), the excessive loss suppresses the NFRHT. Hyperbolic polaritons (HPs) can effectively explain the above phenomenon, as confirmed by energy transmission coefficients distribution and dispersion relation in wavevector space. In particular, the volume-confined hyperbolic polaritons play a dominant role in the flux variation between the thin films (1 nm and 10 nm). For the 100-nm film, surface-confined hyperbolic polaritons are more important. This study sheds light on the effect of substrate on HPs and provides theoretical guidance for designing near-field thermal radiation devices.
engineering, mechanical,thermodynamics,mechanics