Hydrogen as power storage technology, polymeric and interconnect material innovations for future AI datacenter applications: a review

Chong Leong Gan,Min-Hua Chung,Chen-Yu Huang,Li Jao
DOI: https://doi.org/10.1007/s10854-024-13705-y
2024-10-25
Journal of Materials Science Materials in Electronics
Abstract:The recent surge in AI deployment, particularly through platforms like OpenAI's ChatGPT, has significantly contributed to the expansion of datacenter infrastructure. The datacenter itself has contributed 1.5% to the total world electricity consumption and this is expected to increase with time. The proportion of energy used in the datacenter covers 52% for information technology (IT) equipment, 38% for cooling and 10% for supporting devices. One of the problems faced by these centers over the years is the cooling of the information technology (IT) system and electrical power requirements. Datacenter can be broken down into computing system, networking, and storage; these are packaged in servers. Underlying that is the technology necessary to run the datacenter such as power and cooling technology, as well as 3rd party operators of the datacenters (A primer on data center. https://blog.publiccomps.com/a-primer-on-data-centers/2024). Hence, with recent callout for greener technology and carbon footprint reduction initiative by corporates, it is crucial to innovate in alternate power storage technologies such as hydrogen as power technology, and immersion cooling and future cryogenic computing to mitigate tremendous energy supply for future AI datacenters. This paper discusses some of those key literature reviews of hydrogen-based power storage technologies, materials innovation for enabling immersion cooling and cryogenic quantum computing.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
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