Deep learning-driven pavement crack analysis: Autoencoder-enhanced crack feature extraction and structure classification

Miaomiao Zhang,Jingtao Zhong,Changhong Zhou,Xiaoyang Jia,Xingyi Zhu,Baoshan Huang
DOI: https://doi.org/10.1016/j.engappai.2024.107949
IF: 8
2024-01-29
Engineering Applications of Artificial Intelligence
Abstract:In practice, some asphalt pavements may exhibit significant cracking despite being structurally sound, or conversely, minimal cracking while having structural weaknesses. This inconsistency could be attributed to the limitation of commonly used crack features, i.e., the crack area, which is defined based on human experience and may not fully capture the crack information relevant to pavement structural conditions. To address it, this study proposed a computer-oriented method that utilizes the autoencoder to extract crack features (called encoded features) from pavement crack images, thus linking pavement cracks to their corresponding structural conditions. The original crack images (128*128 pixels) are compressed into the encoded features (4*4 pixels) by the proposed autoencoder. The encoded feature is represented digitally and is difficult for humans to understand, but it retains as much useful information as possible and is therefore a more accurate representation of pavement cracks. On this basis, random forests (RF) classifiers were developed to classify crack images into strong and weak pavement structures. RF classifiers trained on encoded features outperform those trained on original images. For crack images with more than 20 % cracks, cracks on wheel paths play the most important role in the structure classification, and their presence indicates potential pavement structural weakness. However, for crack images with less than 5 % cracks, cracks are randomly distributed and contain less structural information. Overall, it is recommended to encode the original crack images by autoencoders for data storage and RF structural classification.
automation & control systems,computer science, artificial intelligence,engineering, electrical & electronic, multidisciplinary
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