Thermally Conductive and Insulating Epoxy Composites by Synchronously Incorporating Si-sol Functionalized Glass Fibers and Boron Nitride Fillers
Rui-Han Zhang,Xue-Tao Shi,Lin Tang,Zheng Liu,Jun-Liang Zhang,Yong-Qiang Guo,Jun-Wei Gu
DOI: https://doi.org/10.1007/s10118-020-2391-0
2020-01-01
Chinese Journal of Polymer Science
Abstract:Glass fibers (GFs)/epoxy laminated composites always present weak interlaminar shear strength (ILSS) and low cross-plane thermal conductivity coefficient (λ ⊥ ). In this work, silica-sol, synthesized from tetraethyl orthosilicate (TEOS) and KH-560 via sol-gel method, was employed to functionalize the surface of GFs (Si-GFs). Together with a spherical boron nitride (BNN-30), the thermally conductive BNN-30/Si-GFs/epoxy laminated composites were then fabricated. Results demonstrate that Si-sol is beneficial to the improvement of mechanical properties for epoxy laminated composites (especially for ILSS). The BNN-30/Si-GFs/epoxy laminated composites with 15 wt% BNN-30 fillers display the optimal comprehensive properties. In-plane λ ( λ // ) and λ ⊥ reach the maximum of 2.37 and 1.07 W·m −1 ·K −1 , 146.9% and 132.6% higher than those of Si-GFs/epoxy laminated composites ( λ // = 0.96 W·m −1 ·K −1 and λ ⊥ = 0.46 W·m −1 ·K −1 ), respectively, and also about 10.8 and 4.9 times those of pure epoxy resin ( λ // = λ ⊥ 0.22 W·m −1 ·K −1 ). And the heat-resistance index ( T HRI ), dielectric constant ( ε ), dielectric loss (tan δ ), breakdown strength ( E 0 ), surface resistivity ( ρ s ) as well as volume resistivity ( ρ v ) are 197.3 °C, 4.95, 0.0046, 22.3 kV·mm −1 , 1.8 × 10 14 Ω, and 2.1 × 10 14 Ω·cm, respectively.